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Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys

  • H. R. KotadiaEmail author
  • S. H. Mannan
  • A. Das
Open Access
Article
  • 21 Downloads

Abstract

In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at 150°C. Thermodynamically stable intermetallics (IMCs) Cu-Zn and Cu-Sn formed at the interface depending on the solder composition. Formation of different interfacial IMCs during soldering and after prolonged aging is explained by the spalling mechanism that resulted from the depletion of Zn from the solder matrix.

Keywords

Soldering intermetallics wettability spalling lead-free solder Sn-Zn alloys 

Notes

Acknowledgments

This research was funded by the Engineering and Physical Sciences Research Council (Grant No. EP/G054339/1) in collaboration with Henkel Technologies, Dynex, and Schlumberger.

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© The Author(s) 2019

Open AccessThis article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.

Authors and Affiliations

  1. 1.Warwick Manufacturing GroupThe University of WarwickCoventryUK
  2. 2.Department of PhysicsKing’s College LondonStrand, LondonUK
  3. 3.Materials Research Centre, College of EngineeringSwansea University Bay CampusSwanseaUK

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