Journal of Electronic Materials

, Volume 48, Issue 1, pp 53–57 | Cite as

Co-P Diffusion Barrier for p-Bi2Te3 Thermoelectric Material

  • Chun-Hsien Wang
  • Hsien-Chien Hsieh
  • Hsin-Yi Lee
  • Albert T. WuEmail author
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder
Part of the following topical collections:
  1. TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder


(Bi0.25Te0.75)2Te3 (p-Bi2Te3) is thermoelectric material that can harvest waste heat into useful electric power. A severe reaction between p-Bi2Te3 and Sn-based solder decreases the reliability of thermoelectric modules. Sn/p-Bi2Te3 and Sn3.0Ag0.5Cu (SAC305)/p-Bi2Te3 with and without electroless Co-P at the interfaces were investigated in this study. Without a Co-P layer, brittle SnTe, Sn3Sb2, and Bi precipitates formed at the interface. A thin layer of SnTe after reflow results in growth of a layer-type Sn3Sb2 instead of a strip-like Sn3Sb2. The addition of a Co-P layer to both systems successfully inhibited the formation of brittle intermetallic compounds. Shear test results confirmed that the Co-P diffusion barrier also effectively increased the joint strength.


Thermoelectric materials electroless Co-P diffusion barrier interfacial reaction shear strength 


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Copyright information

© The Minerals, Metals & Materials Society 2018

Authors and Affiliations

  • Chun-Hsien Wang
    • 1
  • Hsien-Chien Hsieh
    • 1
  • Hsin-Yi Lee
    • 2
  • Albert T. Wu
    • 1
    Email author
  1. 1.Department of Chemical and Materials EngineeringNational Central UniversityTaoyuan CityTaiwan
  2. 2.National Synchrotron Radiation Research CenterHsinchuTaiwan

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