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Journal of Electronic Materials

, Volume 48, Issue 1, pp 1–8 | Cite as

Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

  • Chao Huang
  • Li Rao
  • Menglong Sun
  • Anmin HuEmail author
  • Ming Li
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder
  • 52 Downloads
Part of the following topical collections:
  1. TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder

Abstract

The reliability of Sn-Ag-Cu (SAC) solder welded with Cu-organic solderability preservative (OSP) and NiAu- or NiPdAu-coated ball grid array (BGA) package pads has been investigated after isothermal aging. Moreover, the interfacial reaction and diffusion reaction are discussed. The intermetallic compound (IMC) layer was found to be too thick to withstand large stresses, leading to poor reliability of the solder joints on Cu-OSP pads. Additionally, for NiAu-coated pads, not only irregular Au-rich phases but also more diffused Ni without the barrier effect of Pd promoted formation of IMC in the solder balls, resulting in a potential mismatch with the initial solder. Compared with the NiAu-coated pad, the IMC layer that formed between the NiPdAu-coated pads and SAC105 solder was thinner, indicating an effective diffusion barrier effect of the Pd layer in the NiPdAu coating. Hence, SAC105 solder showed superior reliability on BGA package pads coated with NiPdAu.

Keywords

Reliability fracture interfacial reaction intermetallic compound diffusion reaction 

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Notes

Acknowledgements

The authors wish to thank the Instrumental Analysis Center of Shanghai Jiao Tong University for SEM equipment. This work was supported by the National Basic Research Program of China (973 Program No. 2015CB057200) and the National Nature Science Foundation of China (Nos. 61176097 and 61376107).

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Copyright information

© The Minerals, Metals & Materials Society 2018

Authors and Affiliations

  • Chao Huang
    • 1
  • Li Rao
    • 1
  • Menglong Sun
    • 1
  • Anmin Hu
    • 1
    Email author
  • Ming Li
    • 1
  1. 1.State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and EngineeringShanghai Jiao Tong UniversityShanghaiChina

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