Journal of Electronic Materials

, Volume 48, Issue 4, pp 2356–2363 | Cite as

Effect of Macro-scale Mechanical Stress of Silicon Wafer on Room Temperature Photoluminescence Signals

  • Yeongsik Yoo
  • Woo Sik YooEmail author


Mechanical stress was applied to single side polished and double side polished Si wafers in polypropylene wafer containers for different localized stress levels and durations. Room temperature photoluminescence (RTPL) spectra from Si wafers were measured before and after applying localized mechanical stress. Significant changes (up to 26% increase) in RTPL intensity were measured from areas under different stress levels even 1 year after the fixtures for mechanical stress generation were removed. Significant effects of localized mechanical stress on RTPL intensity variations were measured up to 49 days after the fixture removal. Nearly fully relaxed RTPL signatures for localized mechanical stress were measured 450 days after the fixture removal. RTPL intensity is found to be very sensitive to the externally applied macro-scale mechanical stress of Si wafers and residual (or memorized) internal stress even after removal of fixtures for external mechanical stress generation.


Silicon mechanical stress room temperature photoluminescence stress relaxation 


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.



The authors would like to thank Mr. T. Ishigaki, Mr. K. Kang and Mr. J. Schram of WaferMasters, Inc. for experimental arrangement and technical discussions on experimental results.


  1. 1.
    N.P. Singh, Phys. Status Solidi A 1, 259 (1970).CrossRefGoogle Scholar
  2. 2.
    Y. Song, H. Zhou, Q. Xu, J. Luo, H. Yin, J. Yan, and H. Zhong, J. Electron. Mater. 48, 1584 (2011).CrossRefGoogle Scholar
  3. 3.
    P. Packan, S. Cea, H. Deshpande, T. Ghani, M. Giles, O. Golonzka, M. Hattendorf, R. Kotlyar, K. Kun, A. Murthy, P. Ranade, L. Shifren, C. Weber, and K. Zawadzki, IEDM Conference Technical Digest (San Francisco, CA, December 15–17, 2008), pp. 63–66.
  4. 4.
    W.S. Yoo, T. Ishigaki, and K. Kang, ECS J. Sold State Sci. Technol. 5, P3064 (2016).CrossRefGoogle Scholar
  5. 5.
    W.S. Yoo, B.G. Kim, S.W. Jin, T. Ishigaki, and K. Kang, ECS J. Solid State Sci. Technol. 3, N142 (2014).CrossRefGoogle Scholar
  6. 6.
    J.H. Kim, S.M. Han, and W.S. Yoo, ECS J. Solid State Sci. Technol. 5, P438 (2016).CrossRefGoogle Scholar
  7. 7.
    X. Xu and V. Moroz, Mater. Res. Soc. Symp. Proc. 863, B8.25.1 (2005).Google Scholar
  8. 8.
    V. Sukharev, A. Kteyan, J.-H. Choy, H. Hovsepyan, A. Markosian, E. Zschech, and R. Huebner, in AIP Conference Proceedings (2012), p. 249.Google Scholar

Copyright information

© The Minerals, Metals & Materials Society 2019

Authors and Affiliations

  1. 1.Dankook UniversityYongin-siKorea
  2. 2.WaferMasters, Inc.DublinUSA

Personalised recommendations