Improvement of Interfacial Strength with the Addition of Ni in Al/Cu Dissimilar Joints Produced via Laser Brazing
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Dissimilar metal joining between Al and Cu is effective to reduce the cost and weight of electrical components. In this study, dissimilar laser lap brazing of Al containing Ni to pure Cu was conducted, and the effect of the addition of Ni on the joint strength and microstructure at the dissimilar interface was examined. The addition of Ni higher than 2.8 at. pct improved the joint strength effectively, even though the thickness of the IMC layer at the dissimilar interface increased. The addition of Ni additionally produced not only (Ni,Cu)Al particles in θ-Al2Cu but also a (Ni,Cu)Al layer at the θ-Al2Cu/γ1-Al4Cu9 interface. This study implied that the addition of Ni to Al resulted in the formation of a (Ni,Cu)Al layer at the weakest interface between θ-Al2Cu and γ1-Al4Cu9, drastically increasing the strength of the Al/Cu dissimilar joint.
The authors are grateful to Mr. J.Q. Zhang, Mr. A. Honda, and Dr. K. Kobayashi for their technical assistance and acknowledge Professor N. Hirata for the preparation of the Al alloy used in this study. They also thank Professors T. Narushima and R. Kainuma for their helpful discussion. This work was partially supported by a Grant-in-Aid for Challenging Exploratory Research and a program named “Next Generation Automobiles in Miyagi,” partially entrusted by the Ministry of Education, Culture, Sports, Science and Technology, Japan.
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