Flatness maintenance and roughness reduction of silicon mirror in chemical mechanical polishing process

  • BoCheng Jiang
  • DeWen Zhao
  • BingQuan Wang
  • HuiJia Zhao
  • YuHong LiuEmail author
  • XinChun LuEmail author


As an important optical component in laser system, silicon mirror surface is required to have micron-level flatness and subnanometer-level roughness. The research concentrates on how to improve roughness as far as possible while maintaining flatness of silicon mirror surface during chemical mechanical polishing (CMP) process. A polishing edge effect model is established to explain the reason of flatness deterioration, and a roughness theoretical model is set up to get the limit of perfect surface roughness. Based on the models above, a polishing device is designed to maintain the surface flatness, and the optimized polishing process parameters are obtained by orthogonal tests to get a near-perfect surface roughness. Finally the maintenance of flatness and the improvement of roughness can be achieved at the same time in one step of CMP process. This work can be a guide for silicon mirror manufacture to improve optical reflection performance significantly.

chemical mechanical polishing silicon mirror flatness maintenance roughness reduction 


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Copyright information

© Science China Press and Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringTsinghua UniversityBeijingChina
  2. 2.Hwatsing Technology Co., LtdTianjinChina

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