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Experimental Mechanics

, Volume 59, Issue 7, pp 1075–1086 | Cite as

Measurements of Inelastic Strain Evolution of Single Solder Grain Subject to Nominal Shear Loading

  • B. Wu
  • B. HanEmail author
  • J. Schumacher
Article
  • 118 Downloads

Abstract

A novel E-shaped symmetric configuration is proposed and implemented to document deformation evolutions of single-grain solder joints with different orientations. The configuration is fabricated from two metals with different coefficient of thermal expansions to produce precisely-controlled shear-dominant loading to solder joints when subjected to a thermal excursion. Cooling rates during solder solidification are controlled to produce joints with a large single grain of Sn-based Pb-free solder. Moiré interferometry is employed to measure the detailed in-situ deformations of single grain solder joints during a thermal cycle of −40 °C to 125 °C. The results are analyzed to provide the history of grain orientation-dependent inelastic strain evolutions. The results are aimed at calibrating and verifying the anisotropic constitutive models developed for Sn-based Pb-free solder alloys.

Keywords

Tin-based solder SAC305 solder Thermo-mechanical deformation grain orientation Moiré interferometry Anisotropic properties 

Notes

Acknowledgements

The polarizing microscope images shown in Figs. 5 and 6 were obtained at the laboratory of Prof. Sarah Penniston-Dorland (Department of Geology, University of Maryland). Her support during the measurements is gratefully acknowledged.

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Copyright information

© Society for Experimental Mechanics 2019

Authors and Affiliations

  1. 1.Mechanical Engineering DepartmentUniversity of MarylandCollege ParkUSA
  2. 2.Center for Nanoscale Science and TechnologyNational Institute of Standards and TechnologyGaithersburgUSA

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