Development of Solute-solvent Separation Soft Lithography Grating for Measuring High-temperature In situ Deformation Using Scanning Electron Microscope Moiré Method
- 121 Downloads
In this study, a technique is developed for fabricating high-temperature solute-solvent separation soft lithography (HSS-SL) grating for metallic materials. Using this technique, a 150 lines/mm crossing-type grating is directly fabricated on the surface of a miniaturized single edge notch tension (SENT) specimen. Further, the microstructure of the grating is analyzed using scanning electron microscope (SEM) and atom force microscope. The grating is found to be highly suited for forming high-contrast SEM moiré fringes. In addition, the chemical composition of the grating is characterized using energy dispersive X-ray spectroscope (EDS), whose results indicate that the grating exhibits good resistance to high-temperature oxidation owing to the high heat endurance of its constituent materials, SiO and SiO2. With respect to high-temperature applications, the HSS-SL grating is employed successfully for measuring the linear thermal expansion coefficient of GH2036 alloy at temperatures of 25-600 °C. Moreover, the high-temperature displacement and strain fields around the semicircular notch of the SENT specimen are determined based on the SEM moiré. These results confirm that thus-fabricated HSS-SL gratings show high potential for use in high-temperature in situ deformation measurements using the SEM moiré method.
KeywordsSolute-solvent separation soft lithography SEM moiré High temperature Linear thermal expansion coefficient Displacement and strain fields
This research was financially supported by the National Natural Science Foundation of China (Grant Nos. 11672153 and 11232008).
- 9.Yamauchi Y, Nagaura T, Takai K, Suzuki N, Sato K, Fukata N, Inoue S, Kishimoto S (2009) Generation of Electron Moiré Fringes on Designed Nanoporous Anodic Alumina Films and Their Replicated Ni Cone Arrays: Exploration of Domain Sizes and Nanopore Arrangements. J Phys Chem C 113(22):9632–9637CrossRefGoogle Scholar