Effects of the total content of eutectic Sn-Cu alloy and Cu particles used as conductive filler on the structure and properties of polyamide-66 composites

  • Honglei Xia
  • Mingjing Zou
  • Yajie Lei
  • Jiangping HeEmail author
  • Fengshun Zhang
  • Tao Liu
  • Ming Li
  • Dongcheng Liang


Incorporating both a low-melting-point metal (LMPM) and a high-melting-point metal (HMPM) into a polymer is a promising approach to prepare highly conductive, melt-processable composites. The effects of the total content of the two metals on the structure and properties of the composites were studied in this work through a eutectic Sn-Cu alloy/Cu particles/polyamide-66 ternary system. The structure, conductivity, fluidity and toughness of the composites were characterized by scanning electron microscopy, four-point probe or two-electrode method, small amplitude oscillatory shear testing and Charpy impact testing, respectively. The results show that the morphology of metal phase in the composites transforms from isolated “islands” to a physically continuous network as the total metal content increases. The percolation threshold for the composites is lower than that of traditional metal-filled polymer composites. The complex viscosity and impact strength of the composites vary non-monotonically with the total metal content and exhibit a minimum. The enhancement in the conductivity and toughness of the composites is related to the formation of the physically continuous conductive network. Overall, the filler content dependences of the structure and properties of the LMPM/HMPM/polymer composites are different from those of traditional conductive polymer composites. The combination of LMPM and HMPM helps reduce the filler content and mitigate the composite fluidity deterioration.


Conductive polymer composites Structure Conductivity Fluidity Toughness Low-melting-point metal 



This work was supported by National Natural Science Foundation of China (Project 51073143). Sun Suming, Xu Xiang, Wang Xianzhong and Liu Tianli were acknowledged for their help in the experimental work.

Compliance with ethical standards

Conflict of interest

The authors declared that they have no conflicts of interest to this work.


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Copyright information

© Springer Nature B.V. 2018

Authors and Affiliations

  1. 1.Institute of Chemical MaterialsChina Academy of Engineering PhysicsMianyangPeople’s Republic of China
  2. 2.School of Material Science and EngineeringSouthwest University of Science and TechnologyMianyangPeople’s Republic of China
  3. 3.Metrology and Testing Center of China Academy of Engineering PhysicsMianyangPeople’s Republic of China

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