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Journal of Low Temperature Physics

, Volume 193, Issue 3–4, pp 578–584 | Cite as

Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

  • Xavier de la Broïse
  • Alain Le Coguie
  • Jean-Luc Sauvageot
  • Claude Pigot
  • Xavier Coppolani
  • Vincent Moreau
  • Samuel d’Hollosy
  • Timur Knarosovski
  • Andreas Engel
Article

Abstract

We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

Keywords

Superconducting flexible PCB Cryo-electronics Cryogenics 

Notes

Acknowledgements

The research leading to these results has received funding from European Space Agency (ESA), from French Space Agency (CNES), and from the European Union’s Horizon 2020 Programme under the AHEAD project (Grant Agreement No. 654215).

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  • Xavier de la Broïse
    • 1
  • Alain Le Coguie
    • 1
  • Jean-Luc Sauvageot
    • 1
  • Claude Pigot
    • 1
  • Xavier Coppolani
    • 1
  • Vincent Moreau
    • 1
  • Samuel d’Hollosy
    • 2
  • Timur Knarosovski
    • 2
  • Andreas Engel
    • 2
  1. 1.IRFU, CEAUniversité Paris-SaclayGif-sur-YvetteFrance
  2. 2.Hightec MC AGLenzburgSwitzerland

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