Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB
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Microstrip copper lines play an important role in high-speed printed circuit boards. It is necessary to perform appropriate surface finishing on the microstrip copper lines to avoid oxidation and reduce the loss of signal transmission. In this work, the microstrip copper lines after micro etching treatment were finished with immersion silver, immersion tin and electroless nickel immersion gold (ENIG), respectively. Surface microstructures, 3D features and surface contact angle were examined to find the effect of the copper finishing on signal transmission loss. The results indicated that the microstrip copper lines with micro-etching treatment exhibits low signal transmission loss as − 39.9 dB/m at 20 GHz. The tested microstrip copper lines showed that signal transmission loss follows an increasing trend successively with micro etching treatment, immersion silver treatment, immersion tin treatment and ENIG treatment.
The authors gratefully acknowledge the support of National Natural Science Foundation of China (Nos. 51801018 and 21603027). This work is also supported by the Open Foundation of State Key Laboratory of Electronic Thin Films and Integrated Devices (No. KFJJ201809) and the project of science and technology planning of Zhuhai City (No. ZH01084702180040HJL).
Compliance with ethical standards
Conflict of interest
No potential conflict of interest was reported by the authors.
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