Journal of Materials Science: Materials in Electronics

, Volume 30, Issue 17, pp 16226–16233 | Cite as

Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB

  • Yuanming Chen
  • Yali Gao
  • Xiaofeng Jin
  • Xuan Zhou
  • Shouxu WangEmail author
  • Wei He
  • Yan Hong
  • Guoyun Zhou
  • Weihua Zhang
  • Rui Sun
  • Yunzhong Huang
  • Yao Tang


Microstrip copper lines play an important role in high-speed printed circuit boards. It is necessary to perform appropriate surface finishing on the microstrip copper lines to avoid oxidation and reduce the loss of signal transmission. In this work, the microstrip copper lines after micro etching treatment were finished with immersion silver, immersion tin and electroless nickel immersion gold (ENIG), respectively. Surface microstructures, 3D features and surface contact angle were examined to find the effect of the copper finishing on signal transmission loss. The results indicated that the microstrip copper lines with micro-etching treatment exhibits low signal transmission loss as − 39.9 dB/m at 20 GHz. The tested microstrip copper lines showed that signal transmission loss follows an increasing trend successively with micro etching treatment, immersion silver treatment, immersion tin treatment and ENIG treatment.



The authors gratefully acknowledge the support of National Natural Science Foundation of China (Nos. 51801018 and 21603027). This work is also supported by the Open Foundation of State Key Laboratory of Electronic Thin Films and Integrated Devices (No. KFJJ201809) and the project of science and technology planning of Zhuhai City (No. ZH01084702180040HJL).

Compliance with ethical standards

Conflict of interest

No potential conflict of interest was reported by the authors.


  1. 1.
    H. Lo, P. Ho, C. Huang, J. Hsu, T. Su, Electrical characterization for performance-driven printed circuit board. in Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), pp. 95–98 (2016)Google Scholar
  2. 2.
    S. Haga, K. Nakano, O. Hashimoto, Reduction in radiated emission by symmetrical power-ground layer stack-up PCB with no open edge. Electromagn. Compat. 1, 262–267 (2002)Google Scholar
  3. 3.
    T. Liang, S. Hall, H. Heck, G. Brist, A practical method for modeling PCB transmission lines with conductor surface roughness and wideband dielectric properties. in Microwave Symposium Digest, pp. 1780-1783 (2006)Google Scholar
  4. 4.
    B.D. RussellS, S. Blackburn, D.I. Wilson, A study of surface fracture in paste extrusion using signal processing. J of Mater Sci. 10(41), 2895–2906 (2006)CrossRefGoogle Scholar
  5. 5.
    H. Zhou, X. Gao, J. Lai, W. Hu, Q. Deng, D. Zhou, Natural frequency optimization of wireless power systems on power transmission lines. IEEE Access 6, 14038–14047 (2018)CrossRefGoogle Scholar
  6. 6.
    C. Zhang, Z. Shi, F. Mao et al., Polymer composites with balanced dielectric constant and loss via constructing trilayer architecture. J. Mater. Sci. 53(18), 13230–13242 (2018)CrossRefGoogle Scholar
  7. 7.
    S. Bhattacharjee, M.A. Alim, Frequency dependent impedance and admittance (immittance) data-handling and interpretation using complex plane formalisms via nonlinear regression analysis for smart electronic materials and devices: overview and case studies. J. Mater. Sci: Mater. Electron. 26(7), 4521–4540 (2015)Google Scholar
  8. 8.
    C. Wang et al., Incorporation of Tin on Copper Clad Laminate to Increase the Interface Adhesion for Signal Loss Reduction of High-frequency PCB Lamination. Appl. Surf. Sci. 422, 738–744 (2017)CrossRefGoogle Scholar
  9. 9.
    E. Liew et al., Signal transmission loss due to copper surface roughness in high-frequency region. in Proceedings of IPC APEX EXPO 2014 Technical Conference (2014)Google Scholar
  10. 10.
    A. Tsuchiya, H. Onodera, Impact of skin effect on loss modeling of on-chip transmission-line for terahertz integrated circuits. in 2013 IEEE International Meeting for Future of Electron Devices, pp. 106–107 (2013)Google Scholar
  11. 11.
    S. Wang, X. Xu, G. Zhou et al., Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process. Circuit World 44(2), 53–59 (2018)CrossRefGoogle Scholar
  12. 12.
    L. Liu, Z. Chen, C. Liu, Y. Wu, B. An, Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bending. Intermetallics 76, 10–17 (2016)CrossRefGoogle Scholar
  13. 13.
    L. Liu, Z. Chen, Z. Zhou, G. Chen, F. Wu, C. Liu, Diffusion barrier property of electroless Ni-WP coating in high temperature Zn-5Al/Cu solder interconnects. J. Alloys Compds. 722, 746–752 (2017)CrossRefGoogle Scholar
  14. 14.
    J. Xiang, C. Wang, J. Wang, Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates. Appl. Surf. Sci. 411, 82–90 (2017)CrossRefGoogle Scholar
  15. 15.
    Y. Chen et al., Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates. Composite B 158, 400–405 (2019)CrossRefGoogle Scholar
  16. 16.
    Y. Chen, X. Gao, J. Wang, W. He, V.V. Silberschmidt, Properties and application of polyimide-based composites by blending surface functionalized boron nitride nanoplates. J. Appl. Polym. Sci. 132(16), 41889 (2015)Google Scholar
  17. 17.
    Y. Chen, Q. Gao, X. He, K. Zhu, Enhancing adhesion performance of no-flow prepreg to form multilayer structure of printed circuit boards with plasma-induced surface modification. Surf. Coat. Technol. 333, 24–31 (2018)CrossRefGoogle Scholar
  18. 18.
    X. Wu, O.M. Ramahi, G.A. Brist, D.P. Cullen, Surface finish effects on high-speed interconnects. in ASME 2003 International Electronic Packaging Technical Conference and Exhibition, pp. 43–46 (2003)Google Scholar
  19. 19.
    P. Liu, P. Yao, J. Liu, Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SnPb solder joints with different PCB surface finishes. J. Alloys Compds. 470, 188–194 (2009)CrossRefGoogle Scholar
  20. 20.
    D. Cullen, B. Kline, G. Moderhock, L. Gatewood, Effects of surface finish on high frequency signal loss using various substrate materials. Circuitree 14, 80 (2011)Google Scholar
  21. 21.
    J. Hsu, T. Su, X. Ye, C. Lin, Microstrip signal integrity enhancement by using low-loss solder mask. in International Conference on Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), pp. 122–125 (2017)Google Scholar
  22. 22.
    J. Coonrod, Ambiguous influences affecting insertion loss of microwave printed circuit boards. IEEE Microw. Mag. 5(13), 66–75 (2012)CrossRefGoogle Scholar
  23. 23.
    F. Scharf, Y. Tao, EM modeling of board surface finish effect on high speed PCB performance. in Proceedings of DesignCon, pp. 760–785 (2012)Google Scholar
  24. 24.
    B. Curran, I. Ndip, K.-D. Lang, A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs. in 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI), pp. 1–3 (2017)Google Scholar
  25. 25.
    K. Feng, T. Spencer, J. Watkowski, Integrated metallization system for high density interconnects and modified semi additive processing. in Microsystems, Packaging, Assembly and Circuits Technology Conference, pp. 241–244 (2013)Google Scholar
  26. 26.
    M.S. Bell, A. Shahraz, K.A. Fichthorn, A. Borhan, Effects of hierarchical surface roughness on droplet contact angle. Langmuir 24(31), 6752–6762 (2015)CrossRefGoogle Scholar
  27. 27.
    S.-H. Han, B.-J. Kim, J.-S. Park, Effects of the corona pretreatment of PET substrates on the properties of flexible transparent CNT electrodes. Thin Solid Films 572, 73–78 (2014)CrossRefGoogle Scholar
  28. 28.
    L. Guo, X. Zhao, Y. Bai, L. Qiao, Water adsorption behavior on metal surfaces and its influence on surface potential studied by in situ SPM. Appl. Surf. Sci. 22(258), 9087–9091 (2012)CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  • Yuanming Chen
    • 1
  • Yali Gao
    • 1
    • 3
  • Xiaofeng Jin
    • 2
  • Xuan Zhou
    • 1
  • Shouxu Wang
    • 1
    Email author
  • Wei He
    • 1
  • Yan Hong
    • 1
  • Guoyun Zhou
    • 1
  • Weihua Zhang
    • 3
  • Rui Sun
    • 3
  • Yunzhong Huang
    • 1
    • 4
  • Yao Tang
    • 4
  1. 1.School of Materials and Energy & State Key Laboratory of Electronic Thin Films and Integrated DevicesUniversity of Electronic Science and Technology of ChinaChengduChina
  2. 2.National Center of Quality Supervision and Testing for Printed Circuit Board & National Center of Quality Supervision and Testing for Copper-Lead-Zinc ProductTonglingChina
  3. 3.Zhuhai Founder Sci-Tech High-density Electronics Co., LtdZhuhaiChina
  4. 4.Chongqing Founder High-density Electronics Co., LtdChongqingChina

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