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Journal of Materials Science: Materials in Electronics

, Volume 30, Issue 17, pp 16226–16233 | Cite as

Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB

  • Yuanming Chen
  • Yali Gao
  • Xiaofeng Jin
  • Xuan Zhou
  • Shouxu WangEmail author
  • Wei He
  • Yan Hong
  • Guoyun Zhou
  • Weihua Zhang
  • Rui Sun
  • Yunzhong Huang
  • Yao Tang
Article
  • 15 Downloads

Abstract

Microstrip copper lines play an important role in high-speed printed circuit boards. It is necessary to perform appropriate surface finishing on the microstrip copper lines to avoid oxidation and reduce the loss of signal transmission. In this work, the microstrip copper lines after micro etching treatment were finished with immersion silver, immersion tin and electroless nickel immersion gold (ENIG), respectively. Surface microstructures, 3D features and surface contact angle were examined to find the effect of the copper finishing on signal transmission loss. The results indicated that the microstrip copper lines with micro-etching treatment exhibits low signal transmission loss as − 39.9 dB/m at 20 GHz. The tested microstrip copper lines showed that signal transmission loss follows an increasing trend successively with micro etching treatment, immersion silver treatment, immersion tin treatment and ENIG treatment.

Notes

Acknowledgements

The authors gratefully acknowledge the support of National Natural Science Foundation of China (Nos. 51801018 and 21603027). This work is also supported by the Open Foundation of State Key Laboratory of Electronic Thin Films and Integrated Devices (No. KFJJ201809) and the project of science and technology planning of Zhuhai City (No. ZH01084702180040HJL).

Compliance with ethical standards

Conflict of interest

No potential conflict of interest was reported by the authors.

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  • Yuanming Chen
    • 1
  • Yali Gao
    • 1
    • 3
  • Xiaofeng Jin
    • 2
  • Xuan Zhou
    • 1
  • Shouxu Wang
    • 1
    Email author
  • Wei He
    • 1
  • Yan Hong
    • 1
  • Guoyun Zhou
    • 1
  • Weihua Zhang
    • 3
  • Rui Sun
    • 3
  • Yunzhong Huang
    • 1
    • 4
  • Yao Tang
    • 4
  1. 1.School of Materials and Energy & State Key Laboratory of Electronic Thin Films and Integrated DevicesUniversity of Electronic Science and Technology of ChinaChengduChina
  2. 2.National Center of Quality Supervision and Testing for Printed Circuit Board & National Center of Quality Supervision and Testing for Copper-Lead-Zinc ProductTonglingChina
  3. 3.Zhuhai Founder Sci-Tech High-density Electronics Co., LtdZhuhaiChina
  4. 4.Chongqing Founder High-density Electronics Co., LtdChongqingChina

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