The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate
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The effect of Ti addition on the shear behavior of a Zn–25Sn–xTi solder bonding with Ni substrate at 25 °C and 100 °C was investigated. The microstructures of the solder joints had three different phases, which are the Zn-rich phase, laminar Sn-Zn eutectic phase, and the intermetallic compound with some pores. The average atomic composition of the intermetallic compound was 16.38 at.% Zn and 81.46 at.% Ni corresponding to a ratio of Ni to Zn of 1:4.63. The Ni5Zn21 intermetallic compounds were confirmed by Wavelength dispersive spectroscopy and X-ray diffraction analysis. The addition of Ti refined the Zn-rich phase. Moreover, compared with Pb–5Sn/Ni, the Zn–25Sn–xTi/Ni solder joints exhibited superior shear strength at 25 °C and 100 °C. The mechanical properties of the solder joints were further investigated with nanoindentation tests. The Ni5Zn21 intermetallic layer exhibited the lowest value of plasticity parameter compared with the solder matrix and substrate. Accordingly, shear fracture tended to occur in the IMC layer at room temperature.
The financial support for this study by the Ministry of Science and Technology, Republic of China (Taiwan) under MOST 107-2221-E-006-014-MY3 is gratefully acknowledged.
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