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Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain

  • Xudong Zhang
  • Xiaowu HuEmail author
  • Xiongxin Jiang
  • Qinglin Li
  • Liuru Zhou
Article
  • 15 Downloads

Abstract

The study investigated the effect of tensile and compressive strain on the interfacial reaction of SAC305/Cu system. Experimental results indicated that the thickness of Cu6Sn5 layer on non-strained samples slightly decreased after aging for 120 h and increased with prolonged aging time. The applied tensile strain had an enhanced effect on the growth of Cu6Sn5 phase, while the applied compressive strain inhibited the growth of Cu6Sn5 phase. However, the thickness of Cu3Sn layer at SAC305/Cu solder joints increased gradually with increasing aging time, regardless of whether strain was or not applied on the solder joints. Besides, the mean diameter of Cu6Sn5 grain increased in three systems as the aging time was prolonged to 480 h. The morphology of Cu6Sn5 grain on non-strained samples gradually changed from round-shape into polyhedron-shape with increased aging time. The morphology of Cu6Sn5 grain under tensile or compressive strain was polyhedron-shape. The Kirkendall voids appeared within Cu3Sn layer in three systems after aging for 120 h and the amount of voids increased gradually with prolonged aging time. The applied tensile or compressive strain had an enhanced effect on the formation of voids within Cu3Sn layer and the enhanced effect of applied tensile strain was much remarkable than that of other systems.

Notes

Acknowledgements

This work was supported by the National Natural Science Foundation of China (Grant No. 51765040), Natural Science Foundation of Jiangxi Province (Grant No. 20161BAB206122) and Postgraduate Innovation special founds of Jiangxi Province (Grant No. YC2018-S060).

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  • Xudong Zhang
    • 1
  • Xiaowu Hu
    • 1
    Email author
  • Xiongxin Jiang
    • 1
  • Qinglin Li
    • 2
  • Liuru Zhou
    • 1
  1. 1.Key Lab for Robot & Welding Automation of Jiangxi Province, Mechanical & Electrical Engineering SchoolNanchang UniversityNanchangPeople’s Republic of China
  2. 2.State Key Laboratory of Advanced Processing and Recycling of Nonferrous MetalsLanzhou University of TechnologyLanzhouPeople’s Republic of China

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