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Microstructure, interfacial reactions and mechanical properties of Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding

  • Shuang Tian
  • Jian Zhou
  • Feng Xue
  • Ruihua Cao
  • Fengjiang Wang
Article
  • 93 Downloads

Abstract

In this paper, the wettability and growth behaviors of interfacial intermetallic compounds (IMCs) in the Sn/Co and Sn/Cu liquid/solid couples were comparatively investigated. In situ tensile tests were conducted to evaluate the mechanical properties of the Co/Sn(IMCs)/Co and Cu/Sn(IMCs)/Cu joints. The wettability of Sn on Cu substrate was better than that of Co substrate. The lath-like CoSn3 IMCs limited the improvement of wettability of Sn on Co substrate, even if the soldering temperature was increased. The Sn/Co couples showed an acceptable wettability for electronic application. During liquid aging, the rapid growing interfacial CoSn3 were controlled by the combination of chemical reaction and atomic diffusion. Grain boundary diffusion should be responsible for the growth of Cu6Sn5 in the Sn/Cu liquid/solid couples. The tensile strength and elongation of the Co/CoSn3/Co joints were basically equal to that of the Cu/IMCs/Cu full IMCs joints. Interfacial IMCs cracks were more likely to occur in the joints fabricated by Co substrate. The Co/CoSn3/Co sandwich structure can be fabricated within a remarkable short period of time at low temperature without pressure.

Notes

Acknowledgements

The authors would like to acknowledge the financial support by the National Natural Science Foundation of China (51004039) and the Opening Project of Jiangsu Key Laboratory of Advanced Structural Materials and Application Technology (ASMA201602).

References

  1. 1.
    Q. Guo, S.Y. Sun, Z.H. Zhang, H.T. Chen, M.Y. Li, Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test. Microelectron. Reliab. 80, 144–148 (2018)CrossRefGoogle Scholar
  2. 2.
    Y.H. Tian, C.J. Hang, X. Zhao, B.L. Liu, N. Wang, C.Q. Wang, Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid-liquid interdiffusion bonding. J. Mater. Sci.: Mater. Electron. 25, 4170–4178 (2014)Google Scholar
  3. 3.
    T.Q. Hu, H.T. Chen, M.Y. Li, Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures. Mater. Des. 108, 383–390 (2016)CrossRefGoogle Scholar
  4. 4.
    Q. Guo, F.W. Yu, H.T. Chen, M.Y. Li, Microstructure evolution during reflow and thermal aging in a Ag@Sn TLP bondline for high-temperature power devices. J. Mater. Sci.: Mater. Electron. 29, 3014–3024 (2018)Google Scholar
  5. 5.
    M. Abtew, G. Selvaduray, Lead-free solders in microelectronics. Mater. Sci. Eng. R 27, 95–141 (2000)CrossRefGoogle Scholar
  6. 6.
    H.K. Shao, A.P. Wu, Y.D. Bao, Y. Zhao, G.S. Zou, Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding. J. Mater. Sci.: Mater. Electron. 27, 4839–4848 (2016)Google Scholar
  7. 7.
    H.K. Shao, A.P. Wu, Y.D. Bao, Y. Zhao, L. Liu, G.S. Zou, Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound. Ultrason. Sonochem. 37, 561–570 (2017)CrossRefGoogle Scholar
  8. 8.
    K. Zeng, K.N. Tu, Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. R 38, 55–105 (2002)CrossRefGoogle Scholar
  9. 9.
    C.H. Wang, S.W. Chen, Sn/Co solid/solid interfacial reactions. Intermetallics 16, 524–530 (2008)CrossRefGoogle Scholar
  10. 10.
    C.H. Wang, S.E. Huang, J.L. Liu, Liquid-state interfacial reactions of Sn-Zn/Co couples at 250 °C. J. Electron. Mater. 41, 3259–3265 (2012)CrossRefGoogle Scholar
  11. 11.
    C.H. Wang, K.T. Li, Strong effects of minor Ga addition on liquid-state Sn-Ga/Co interfacial reactions. J. Alloy. Compd. 649, 1197–1204 (2015)CrossRefGoogle Scholar
  12. 12.
    C.H. Wang, S.E. Huang, K.T. Li, Inhibiting CoSn3 growth at the Sn/Co system by minor Zn addition. Intermetallic 56, 68–74 (2015)CrossRefGoogle Scholar
  13. 13.
    C.H. Wang, C.Y. Kuo, Interfacial reactions between eutectic Sn-Pb solder and Co substrate. J. Mater. Sci. 46, 2654–2661 (2011)CrossRefGoogle Scholar
  14. 14.
    D.H. Yang, J. Cai, Q. Wang, J.W. Li, Y. Hu, L.L. Li, IMC growth and shear strength of Sn-Ag-Cu/Co-P ball grid array solder joints under thermal cycling. J. Mater. Sci.: Mater. Electron. 26, 962–969 (2015)Google Scholar
  15. 15.
    N. Lu, D. Yang, L. Li, Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures. Acta Mater. 61, 4581–4590 (2013)CrossRefGoogle Scholar
  16. 16.
    C.H. Wang, C.C. Wen, C.Y. Lin, Solid-state interfacial reactions of Sn and Sn-Ag-Cu solders with an electroless Co(P) layer deposited on a Cu substrate. J. Alloy. Compd. 662, 475–483 (2016)CrossRefGoogle Scholar
  17. 17.
    Z.M. Lai, X.D. Kong, Q.R. You, X.B. Cao, Microstructure and mechanical properties of Co/Sn-10Bi couple and Co/Sn-10Bi/Co joint. Microelectron. Reliab. 68, 69–76 (2017)CrossRefGoogle Scholar
  18. 18.
    T. Matsumoto, K. Nogi, Wetting in soldering and microelectronics. Annu. Rev. Mater. Res. 38, 251–273 (2008)CrossRefGoogle Scholar
  19. 19.
    T. Gancarz, Density, surface tension and viscosity of Ga-Sn alloys. J. Mol. Liq. 241, 231–236 (2017)CrossRefGoogle Scholar
  20. 20.
    H. Wang, H. Zhao, D.P. Sekulic, Y. Qian, A comparative study of reactive wetting of lead and lead-free solders on Cu and (Cu6Sn5/Cu3Sn)/Cu substrates. J. Electron. Mater. 37, 1640–1647 (2008)CrossRefGoogle Scholar
  21. 21.
    O.Y. Liashenko, F. Hodaj, Wetting and spreading kinetics of liquid Sn on Ag and Ag3Sn substrates. Scr. Mater. 127, 24–28 (2017)CrossRefGoogle Scholar
  22. 22.
    K.N. Satyanarayan, Prabhu, Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy. Adv. Colloid Interface Sci. 166, 87–118 (2011)CrossRefGoogle Scholar
  23. 23.
    R.Y. Tian, Y.H. Tian, C.X. Wang, L.Y. Zhao, Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures. Mater. Sci. Eng. A 684, 697–705 (2017)CrossRefGoogle Scholar
  24. 24.
    T. Laurila, V. Vuorinen, J.K. Kivilahti, Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng. R 49, 1–60 (2005)CrossRefGoogle Scholar
  25. 25.
    R.Y. Tian, C.J. Hang, Y.H. Tian, L.Y. Zhao, Growth behavior of intermetallic conpounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock. Mater. Sci. Eng. A 709, 125–133 (2018)CrossRefGoogle Scholar
  26. 26.
    M.A.A. Mohd Salleh, S.D. McDonald, H. Yasuda, A. Sugiyama, K. Nogita, Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces. Scr. Mater. 100, 17–20 (2015)CrossRefGoogle Scholar
  27. 27.
    X.W. Hu, Y.L. Li, Z.X. Min, Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging. J. Alloy. Compd. 582, 341–347 (2014)CrossRefGoogle Scholar
  28. 28.
    J.P. Rong, Z.F. Kang, S.H. Chen, D.W. Yang, J.H. Huang, J. Yang, Growth kinetics and thickness prediction of interfacial intermetallic compounds between solid steel and molten aluminum based on thermophysical simulation in a few seconds. Mater. Charact. 132, 413–421 (2017)CrossRefGoogle Scholar
  29. 29.
    J. Shen, Y.C. Chan, S.Y. Liu, Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction. Acta Mater. 57, 5196–5206 (2009)CrossRefGoogle Scholar
  30. 30.
    Q.Y. Yin, F. Gao, Z.Y. Gu, J.R. Wang, E.A. Stach, G.W. Zhou, Interface dynamics in one-dimensional nanoscale Cu/Sn couples. Acta Mater. 125, 136–144 (2017)CrossRefGoogle Scholar
  31. 31.
    Y. Yuan, Y.Y. Guan, D.J. Li, N. Moelans, Investigation of diffusion behavior in Cu-Sn solid state diffusion couples. J. Alloy. Compd. 661, 282–293 (2016)CrossRefGoogle Scholar
  32. 32.
    L. Zhang, K.N. Tu, Structure and properties of lead-free solders bearing micro and nano particles. Mater. Sci. Eng. R 82, 1–32 (2014)CrossRefGoogle Scholar
  33. 33.
    F.J. Wang, D.Y. Li, J.H. Wang, X.J. Wang, C.H. Dong, Comparative study on the wettability and interfacial structure in Sn-xZn/Cu and Sn/Cu-xZn system. J. Mater. Sci.: Mater. Electron. 28, 1631–1643 (2017)Google Scholar
  34. 34.
    O.M. Abdelhadi, L. Ladani, IMC growth of Sn-3.5Ag/Cu system: Combined chemical reacion and diffusion mechanisms. J. Alloy. Compd. 537, 87–99 (2012)CrossRefGoogle Scholar
  35. 35.
    A.A. Ibrahiem, E.H. El-Khawas, A.A. El-Daly, Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn-0.5Cu solders for microelectronic applications. J. Mater. Sci.: Mater. Electron. 28, 1060–1069 (2017)Google Scholar
  36. 36.
    A.A. El-Daly, A.M. El-Taher, S. Gouda, Novel Bi-containing Sn-1.5Ag-0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products. Mater. Des. 65, 796–805 (2015)CrossRefGoogle Scholar
  37. 37.
    D.K. Mu, S.D. McDonald, J. Read, H. Huang, K. Nogita, Critical properties of Cu6Sn5 in electronic devices: recent progress and a review. Curr. Opin. Solid State Mater. Sci. 20, 55–76 (2016)CrossRefGoogle Scholar
  38. 38.
    L. Jiang, N. Chawla, Mechanical properties of Cu6Sn5 intermetallic by micropillar compression testing. Scr. Mater. 63, 480–483 (2010)CrossRefGoogle Scholar
  39. 39.
    B. Philippi, K. Matoy, J. Zechner, C. Kirchlechner, G. Dehm, Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics. Scr. Mater. 123, 38–41 (2016)CrossRefGoogle Scholar
  40. 40.
    K.E. Yazzie, H.E. Fei, H. Jiang, N. Chawla, Rate-dependent behavior of Sn alloy-Cu couples: effects of microstructure and composition on mechanical shock resistance. Acta Mater. 60, 4336–4348 (2012)CrossRefGoogle Scholar
  41. 41.
    H. Fei, K. Yazzie, N. Chawla, H. Jiang, Modeling fracture of Sn-rich (Pb-free) solder joints under mechanical shock conditions. J. Electron. Mater. 41, 2089–2099 (2012)CrossRefGoogle Scholar
  42. 42.
    K.E. Yazzie, H.X. Xie, J.J. Williams, N. Chawla, On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints. Scr. Mater. 66, 586–589 (2012)CrossRefGoogle Scholar
  43. 43.
    T.L. Yang, J.Y. Wu, C.C. Li, S. Yang, C.R. Kao, Low temperature bonding for high temperature applications by using SnBi solders. J. Alloy. Compd. 647, 681–685 (2015)CrossRefGoogle Scholar
  44. 44.
    R. Zhang, Y.H. Tian, C.J. Hang, B.L. Liu, C.Q. Wang, Formation mechanism and orientation of Cu3Sn grains in Cu-Sn intermetallic compound joints. Mater. Lett. 110, 137–140 (2013)CrossRefGoogle Scholar
  45. 45.
    C.J. Hang, Y.H. Tian, R. Zhang, D.S. Yang, Phase transformation and grain orientation of Cu-Sn intermetallic compounds during low temperature bonding process. J. Mater. Sci.: Mater. Electron. 24, 3905–3913 (2013)Google Scholar

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© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  1. 1.Jiangsu Key Laboratory for Advanced Metallic MaterialsSoutheast UniversityNanjingChina
  2. 2.Jiangsu Key Laboratory of Advanced Structural Materials and Application TechnologyNanjing Institute of TechnologyNanjingChina
  3. 3.Provincial Key Lab of Advanced Welding TechnologyJiangsu University of Science and TechnologyZhenjiangChina

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