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Journal of Materials Science: Materials in Electronics

, Volume 29, Issue 17, pp 15249–15258 | Cite as

Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system

  • A. Surendar
  • Vahid Samavatian
  • Andino Maseleno
  • Aygul Z. Ibatova
  • Majid Samavatian
Article
  • 44 Downloads

Abstract

In this work, we show that how solder thickness can affect the IGBTs’ useful lifetime. Hence, the thermo-mechanical response of joints in IGBT discrete with different solder thickness under thermal cycling were simulated and the results were merged to conditions of IGBTs in actual environment. The simulation results demonstrated that after thermal cycling, some creep strain is produced in the solder layer especially at the corners. This type of strain is accumulated in the volume of solder as stored energy. Accordingly, the decrease in solder thickness leads to the enhancement of stored energy per volume and as a result, the fatigue life of joint falls to shorter times. The SEM micrographs indicates that with the decrease of solder thickness, the number of voids and their concentration enhance across in the joint zone. The higher strain energy in thinner solder layers leads to the connection of voids and the formation of more concentrated defects. The EDS results also show that the diffusion of elements such as Si, Cu and Ag considerably increases across the joint zone after thermal cycling.

References

  1. 1.
    A.E. Hammad, A.A. Ibrahiem, Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles. Microelectron. Reliab. 75, 187–194 (2017)CrossRefGoogle Scholar
  2. 2.
    T. Satoh, T. Ishizaki, M. Usui, Nanoparticle/solder hybrid joints for next-generation power semiconductor modules. Mater. Des. 124, 203–210 (2017)CrossRefGoogle Scholar
  3. 3.
    W. Lai, M. Chen, L. Ran, S. Xu, N. Jiang, X. Wang, O. Alatise, P. Mawby, Experimental investigation on the effects of narrow junction temperature cycles on die-attach solder layer in an IGBT module. IEEE Trans. Power Electron. 32, 1431–1441 (2017)CrossRefGoogle Scholar
  4. 4.
    D. Ghaderi, M. Pourmahdavi, V. Samavatian, O. Mir, M. Samavatian, Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module. Proc. Inst. Mech. Eng. L (2018)  https://doi.org/10.1177/1464420718780525 Google Scholar
  5. 5.
    H. Nishikawa, N. Iwata, Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad. J. Mater. Process. Technol. 215, 6–11 (2015)CrossRefGoogle Scholar
  6. 6.
    J. Liu, H. Ma, S. Li, J. Sun, A. Kunwar, W. Miao, J. Hao, Y. Bao, The study of interficial reaction during rapidly solidified lead-free solder Sn3.5Ag0.7Cu/Cu laser soldering. in: 15th International Conference on Electronic Packaging Technology, pp. 949–952 (2014)Google Scholar
  7. 7.
    L. Braunwarth, S. Amrhein, T. Schreck, M. Kaloudis, Ecological comparison of soldering and sintering as die-attach technologies in power electronics. J. Clean. Prod. 102, 408–417 (2015)CrossRefGoogle Scholar
  8. 8.
    Y. Gu, T. Nakamura, Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages. Microelectron. Reliab. 44, 471–483 (2004)CrossRefGoogle Scholar
  9. 9.
    K. Aluru, F.L. Wen, Y.L. Shen, Direct simulation of fatigue failure in solder joints during cyclic shear. Mater. Des. 32, 1940–1947 (2011)CrossRefGoogle Scholar
  10. 10.
    G. Cuddalorepatta, A. Dasgupta, S. Sealing, J. Moyer, T. Tolliver, J. Loman, Durability of Pb-free solder between copper interconnect and silicon in photovoltaic cells. Prog. Photovoltaics Res. Appl. 18, 168–182 (2010)CrossRefGoogle Scholar
  11. 11.
    M.T. Zarmai, N.N. Ekere, C.F. Oduoza, E.H. Amalu, Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly. Microelectron. Reliab. 59, 117–125 (2016)CrossRefGoogle Scholar
  12. 12.
    P. Schmitt, P. Kaiser, C. Savio, M. Tranitz, U. Eitner, Intermetallic phase growth and reliability of Sn–Ag-soldered solar cells. Energy Proced. 27, 664–669 (2012)CrossRefGoogle Scholar
  13. 13.
    J.H.L. Pang, Theory on mechanics of solder material. in: Lead Free Solder (Springer, New York, 2012)CrossRefGoogle Scholar
  14. 14.
    V. Le, L. Benabou, V. Etgens, Q. Tao, Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling. Microelectron. Reliab. 65, 243–254 (2016)CrossRefGoogle Scholar
  15. 15.
    L. Feller, S. Hartmann, D. Schneider, Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150. Microelectron. Reliab. 48, 1161–1166 (2008)CrossRefGoogle Scholar
  16. 16.
    M.T. Zarmai, N.N. Ekere, C.F. Oduoza, E.H. Amalu, Evaluation of thermo-mechanical damage and fatigue life of solar cell solder interconnections. Robot. Comput. Integr. Manuf. 47, 37–43 (2017)CrossRefGoogle Scholar
  17. 17.
    E.H. Amalu, N.N. Ekere, High temperature reliability of lead-free solder joints in a flip chip assembly. J. Mater. Process. Technol. 212, 471–483 (2012)CrossRefGoogle Scholar
  18. 18.
    E.H. Amalu, N.N. Ekere, Modelling evaluation of Garofalo-Arrhenius creep relation for lead-free solder joints in surface mount electronic component assemblies. J. Manuf. Syst. 39, 9–23 (2016)CrossRefGoogle Scholar
  19. 19.
    A. Syed, Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints, in: 54th Proceedings of Electronic Components and Technology Conference, Las Vegas, pp. 737–746 (2004)Google Scholar
  20. 20.
    J.H. Lau, Design, materials, process and reliability of lead-free solders for robust IC electronic and optoelectric packaging. in: Electronics Packaging Technology Conference, (2003)Google Scholar
  21. 21.
    M. Ciappa, Selected failure mechanisms of modern power modules. Microelectron. Reliab. 42, 653–667 (2002)CrossRefGoogle Scholar
  22. 22.
    Y.C. Chan, D. Yang, Failure mechanisms of solder interconnects under current stressing in advanced electronic packages. Prog. Mater. Sci. 55, 428–475 (2010)CrossRefGoogle Scholar
  23. 23.
    F.L. Guo, X. Niu, B.B. He, An analytical study on steam-driven delamination and stability of delamination growth in electronic packages. Eng. Fract. Mech. 144, 89–100 (2015)CrossRefGoogle Scholar
  24. 24.
    N. Park, C. Han, J. Jeong, D. Kim, Lifetime prediction model of thermal fatigue stress on crystalline silicon photovoltaic module, in: IEEE 39th Photovoltaic Specialists Conference (PVSC), (2013) 1575–1578Google Scholar
  25. 25.
    S. Kumar, B. Sarkar, Design for reliability with Weibull analysis for photovoltaic modules. Int. J. Curr. Eng. Technol. 3, 129–134 (2013)Google Scholar
  26. 26.
    V. Samavatian, A. Masoumian, M. Mafi, M. Lakzaei, D. Ghaderi, Influence of directional random vibration on the fatigue life of solder joints in a power module, in: IEEE Transactions on Components, Packaging and Manufacturing Technology, (2018)  https://doi.org/10.1109/TCPMT.2018.2838148
  27. 27.
    M. Kuczynska, N. Schafet, U. Becker, B. Métais, A. Kabakchiev, P. Buhl, The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics. Microelectron. Reliab. 74, 155–164 (2017)CrossRefGoogle Scholar
  28. 28.
    M. Samavatian, A. Halvaee, A.A. Amadeh, A. Khodabandeh, An investigation on microstructure evolution and mechanical properties during liquid state diffusion bonding of Al2024 to Ti–6Al–4V. Mater. Charact. 98, 113–118 (2014)CrossRefGoogle Scholar
  29. 29.
    J. Askill, Tracer Diffusion Data for Metals, Alloys, and Simple Oxides (Plenum Press, London, 1970)CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  • A. Surendar
    • 1
  • Vahid Samavatian
    • 2
  • Andino Maseleno
    • 3
  • Aygul Z. Ibatova
    • 4
  • Majid Samavatian
    • 5
  1. 1.School of ElectronicsVignan Foundation for Science, Technology and ResearchGunturIndia
  2. 2.Young Researchers and Elite Club, South Tehran BranchIslamic Azad UniversityTehranIran
  3. 3.Department of Information SystemsSTMIK PringsewuLampungIndonesia
  4. 4.Tyumen Industrial UniversityTyumenRussia
  5. 5.Young Researchers and Elites Club, Science and Research BranchIslamic Azad UniversityTehranIran

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