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Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications

  • Kaya DemirEmail author
  • Vijay Sukumaran
  • Yoichiro Sato
  • Abderrahim El Amrani
  • Koushik Ramachandran
  • Raghuram Pucha
  • P. Markondeya Raj
  • Venkatesh Sundaram
  • Rao Tummala
Article
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Abstract

Glass is an ideal substrate material to enable 2.5D and 3D packaging of ICs at low cost and high performance. However, it is a brittle material and is prone to failures during fabrication and operation. Large coefficient of thermal expansion (CTE) mismatch between copper and glass leads to thermomechanical stresses that can lead to glass cracking and delamination from glass interfaces. This paper focuses on modeling and reliability characterization of copper-plated through-package-vias (TPV) in glass packages. Thermomechanical simulations were carried out to obtain design guidelines for reliable TPVs in glass. Test-vehicles with different glass thicknesses and copper TPV fabrication conditions were fabricated for thermal cycling tests, resistance monitoring and failure analysis. The reliability characterization results showed good thermomechanical reliability of TPVs in ultra-thin glass panels.

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Notes

Acknowledgements

The authors would like to thank the member companies of the 3-D Systems Packaging Research Center (PRC), Georgia Institute of Technology, Atlanta for their support and technical guidance.

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  • Kaya Demir
    • 1
    Email author
  • Vijay Sukumaran
    • 1
  • Yoichiro Sato
    • 2
  • Abderrahim El Amrani
    • 3
  • Koushik Ramachandran
    • 1
  • Raghuram Pucha
    • 1
  • P. Markondeya Raj
    • 1
  • Venkatesh Sundaram
    • 1
  • Rao Tummala
    • 1
  1. 1.Packaging Research CenterGeorgia Institute of TechnologyAtlantaUSA
  2. 2.Asahi Glass Co.YokohamaJapan
  3. 3.Universite Internationale de RabatAl JadidaMorocco

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