Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications
- 107 Downloads
Abstract
Glass is an ideal substrate material to enable 2.5D and 3D packaging of ICs at low cost and high performance. However, it is a brittle material and is prone to failures during fabrication and operation. Large coefficient of thermal expansion (CTE) mismatch between copper and glass leads to thermomechanical stresses that can lead to glass cracking and delamination from glass interfaces. This paper focuses on modeling and reliability characterization of copper-plated through-package-vias (TPV) in glass packages. Thermomechanical simulations were carried out to obtain design guidelines for reliable TPVs in glass. Test-vehicles with different glass thicknesses and copper TPV fabrication conditions were fabricated for thermal cycling tests, resistance monitoring and failure analysis. The reliability characterization results showed good thermomechanical reliability of TPVs in ultra-thin glass panels.
Notes
Acknowledgements
The authors would like to thank the member companies of the 3-D Systems Packaging Research Center (PRC), Georgia Institute of Technology, Atlanta for their support and technical guidance.
References
- 1.J.A. Carballo, W.T.J. Chan, P.A. Gargini, A.B. Kahng, S. Nath, in 32nd IEEE International Conference on Computer Design (ICCD), 2014 (IEEE, 2014), pp 139–146Google Scholar
- 2.J.H. Lau, Microelectron. Int. 28, 8–22 (2011)CrossRefGoogle Scholar
- 3.P. Garrou, C. Bower, P. Ramm, Handbook of 3d Integration: Volume 1-Technology and Applications of 3D Integrated Circuits (Wiley, Weinheim, 2011)Google Scholar
- 4.K. Oi, S. Otake, N. Shimizu, S. Watanabe, Y. Kunimoto, T. Kurihara, T. Koyama, M. Tanaka, L. Aryasomayajula, Z. Kutlu, in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (IEEE, 2014), pp 348–353Google Scholar
- 5.R.R. Tummala, P. Markondeya Raj, S. Atmur, S. Bansal, S. Banerji, F. Liu, S. Bhattacharya, V. Sundaram, K. Shinotani, G. White, J. Electroceram. 13, 417–422 (2004)CrossRefGoogle Scholar
- 6.B. Banijamali, S. Ramalingam, K. Nagarajan, R. Chaware, in Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, (IEEE, 2011), pp 285–290Google Scholar
- 7.J.U. Knickerbocker, P.S. Andry, L.P. Buchwalter, A. Deutsch, R.R. Horton, K.A. Jenkins, Y.H. Kwark, G. McVicker, C.S. Patel, R.J. Polastre, IBM J. Res. Dev. 49, 725–753 (2005)CrossRefGoogle Scholar
- 8.Q. Chen, Y. Suzuki, G. Kumar, V. Sundaram, R.R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 4, 2035–2041 (2014)CrossRefGoogle Scholar
- 9.V. Sukumaran, T. Bandyopadhyay, V. Sundaram, R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 2, 1426–1433 (2012)CrossRefGoogle Scholar
- 10.Z. Wu, J. Min, V. Smet, M.Raj Pulugurtha, V. Sundaram, R.R. Tummala, J. Electron. Packag. 139, 041001 (2017)CrossRefGoogle Scholar
- 11.V. Sukumaran, G. Kumar, K. Ramachandran, Y. Suzuki, K. Demir, Y. Sato, T. Seki, V. Sundaram, R.R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 4, 786–795 (2014)CrossRefGoogle Scholar
- 12.A. Shorey, S. Pollard, Additional Papers and Presentations 2012, vol. 2012, pp. 000832–000845Google Scholar
- 13.P.Markondeya Raj, P. Chakraborti, D. Mishra, H. Sharma, S. Gandhi, S. Sitaraman, R. Tummala, Nanopackaging: From Nanomaterials to the Atomic Scale, (Springer, New York, 2015), pp. 175–189CrossRefGoogle Scholar
- 14.Y. Sato, S. Sitaraman, V. Sukumaran, B. Chou, J. Min, M. Ono, C. Karoui, F. Dosseul, C. Nopper, M. Swaminathan, in Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd (IEEE, 2013), pp 1656–1661Google Scholar
- 15.H. Lu, R. Furuya, B.M.D. Sawyer, C. Nair, F. Liu, V. Sundaram, R.R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 6, 959–967 (2016)CrossRefGoogle Scholar
- 16.T. Wei, Q. Wang, J. Cai, L. Chen, J. Huang, L. Wang, L. Zhang, C. Li, in Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th (IEEE, 2014), pp 601–605Google Scholar
- 17.A. Benali, A.El Amrani, Y. Bouissa, M. Bouya, M. Faqir, M. Ghogho, Y. Benlahoucine, Z. Sbiaa, in ISTFA 2013: Proceedings from the 39th International Symposium for Testing and Failure Analysis (ASM International, Materials Park, 2013), p 463Google Scholar
- 18.M. Lueck, A. Huffman, A. Shorey, in Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th (IEEE, 2015), pp 672–677Google Scholar
- 19.X. Liu, Q. Chen, V. Sundaram, R.R. Tummala, S.K. Sitaraman, Microelectron. Reliab. 53, 70–78 (2013)CrossRefGoogle Scholar
- 20.S.K. Ryu, K.H. Lu, X. Zhang, J.H. Im, P.S. Ho, R. Huang, IEEE Trans. Device Mater. Reliab. 11, 35–43 (2011)CrossRefGoogle Scholar
- 21.A.El Amrani, K. Demir, M. Bouya, M. Faqir, A. Hadjoudja, M. Ghogho, Microelectron. Eng. 165, 6–10 (2016)CrossRefGoogle Scholar
- 22.K. Demir, A. Armutlulu, V. Sundaram, P. Markondeya Raj, R.R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 7, 829–837 (2017)CrossRefGoogle Scholar
- 23.K. Demir, T. Ogawa, V. Sundaram, P. Markondeya Raj, R. Tummala, IEEE Trans. Device Mater. Reliab. 17(4), 683–691 (2017)CrossRefGoogle Scholar
- 24.K. Demir, A. Benali, V. Sundaram, P. Markondeya Raj, R. Tummala, in Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th (IEEE, 2016), pp 799–805Google Scholar
- 25.Q. Chen, H. Lu, V. Sundaram, R.R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 5, 938–944 (2015)CrossRefGoogle Scholar
- 26.S.R. McCann, Y. Sato, V. Sundaram, R.R. Tummala, S.K. Sitaraman, In Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th (IEEE, 2015), pp 1938–1944Google Scholar
- 27.T.C. Lu, J. Yang, Z. Suo, A.G. Evans, R. Hecht, R. Mehrabian, Acta Metall. Mater. 39, 1883–1890 (1991)CrossRefGoogle Scholar
- 28.S. Nakamura, E. Pavlovic, E.J. Kramer, J. Adhes. 83, 351–365 (2007)CrossRefGoogle Scholar
- 29.W. Engelmaier, ASTM Special Technical Publication (ASTM International, Philadelphia, 1982), pp. 279–295Google Scholar
- 30.T. Huang, V. Sundaram, P. Markondeya Raj, H. Sharma, R. Tummala, in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (IEEE, 2014), pp 2266–2270Google Scholar