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Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications

  • Kaya Demir
  • Vijay Sukumaran
  • Yoichiro Sato
  • Abderrahim El Amrani
  • Koushik Ramachandran
  • Raghuram Pucha
  • P. Markondeya Raj
  • Venkatesh Sundaram
  • Rao Tummala
Article
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Abstract

Glass is an ideal substrate material to enable 2.5D and 3D packaging of ICs at low cost and high performance. However, it is a brittle material and is prone to failures during fabrication and operation. Large coefficient of thermal expansion (CTE) mismatch between copper and glass leads to thermomechanical stresses that can lead to glass cracking and delamination from glass interfaces. This paper focuses on modeling and reliability characterization of copper-plated through-package-vias (TPV) in glass packages. Thermomechanical simulations were carried out to obtain design guidelines for reliable TPVs in glass. Test-vehicles with different glass thicknesses and copper TPV fabrication conditions were fabricated for thermal cycling tests, resistance monitoring and failure analysis. The reliability characterization results showed good thermomechanical reliability of TPVs in ultra-thin glass panels.

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Notes

Acknowledgements

The authors would like to thank the member companies of the 3-D Systems Packaging Research Center (PRC), Georgia Institute of Technology, Atlanta for their support and technical guidance.

References

  1. 1.
    J.A. Carballo, W.T.J. Chan, P.A. Gargini, A.B. Kahng, S. Nath, in 32nd IEEE International Conference on Computer Design (ICCD), 2014 (IEEE, 2014), pp 139–146Google Scholar
  2. 2.
    J.H. Lau, Microelectron. Int. 28, 8–22 (2011)CrossRefGoogle Scholar
  3. 3.
    P. Garrou, C. Bower, P. Ramm, Handbook of 3d Integration: Volume 1-Technology and Applications of 3D Integrated Circuits (Wiley, Weinheim, 2011)Google Scholar
  4. 4.
    K. Oi, S. Otake, N. Shimizu, S. Watanabe, Y. Kunimoto, T. Kurihara, T. Koyama, M. Tanaka, L. Aryasomayajula, Z. Kutlu, in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (IEEE, 2014), pp 348–353Google Scholar
  5. 5.
    R.R. Tummala, P. Markondeya Raj, S. Atmur, S. Bansal, S. Banerji, F. Liu, S. Bhattacharya, V. Sundaram, K. Shinotani, G. White, J. Electroceram. 13, 417–422 (2004)CrossRefGoogle Scholar
  6. 6.
    B. Banijamali, S. Ramalingam, K. Nagarajan, R. Chaware, in Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, (IEEE, 2011), pp 285–290Google Scholar
  7. 7.
    J.U. Knickerbocker, P.S. Andry, L.P. Buchwalter, A. Deutsch, R.R. Horton, K.A. Jenkins, Y.H. Kwark, G. McVicker, C.S. Patel, R.J. Polastre, IBM J. Res. Dev. 49, 725–753 (2005)CrossRefGoogle Scholar
  8. 8.
    Q. Chen, Y. Suzuki, G. Kumar, V. Sundaram, R.R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 4, 2035–2041 (2014)CrossRefGoogle Scholar
  9. 9.
    V. Sukumaran, T. Bandyopadhyay, V. Sundaram, R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 2, 1426–1433 (2012)CrossRefGoogle Scholar
  10. 10.
    Z. Wu, J. Min, V. Smet, M.Raj Pulugurtha, V. Sundaram, R.R. Tummala, J. Electron. Packag. 139, 041001 (2017)CrossRefGoogle Scholar
  11. 11.
    V. Sukumaran, G. Kumar, K. Ramachandran, Y. Suzuki, K. Demir, Y. Sato, T. Seki, V. Sundaram, R.R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 4, 786–795 (2014)CrossRefGoogle Scholar
  12. 12.
    A. Shorey, S. Pollard, Additional Papers and Presentations 2012, vol. 2012, pp. 000832–000845Google Scholar
  13. 13.
    P.Markondeya Raj, P. Chakraborti, D. Mishra, H. Sharma, S. Gandhi, S. Sitaraman, R. Tummala, Nanopackaging: From Nanomaterials to the Atomic Scale, (Springer, New York, 2015), pp. 175–189CrossRefGoogle Scholar
  14. 14.
    Y. Sato, S. Sitaraman, V. Sukumaran, B. Chou, J. Min, M. Ono, C. Karoui, F. Dosseul, C. Nopper, M. Swaminathan, in Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd (IEEE, 2013), pp 1656–1661Google Scholar
  15. 15.
    H. Lu, R. Furuya, B.M.D. Sawyer, C. Nair, F. Liu, V. Sundaram, R.R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 6, 959–967 (2016)CrossRefGoogle Scholar
  16. 16.
    T. Wei, Q. Wang, J. Cai, L. Chen, J. Huang, L. Wang, L. Zhang, C. Li, in Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th (IEEE, 2014), pp 601–605Google Scholar
  17. 17.
    A. Benali, A.El Amrani, Y. Bouissa, M. Bouya, M. Faqir, M. Ghogho, Y. Benlahoucine, Z. Sbiaa, in ISTFA 2013: Proceedings from the 39th International Symposium for Testing and Failure Analysis (ASM International, Materials Park, 2013), p 463Google Scholar
  18. 18.
    M. Lueck, A. Huffman, A. Shorey, in Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th (IEEE, 2015), pp 672–677Google Scholar
  19. 19.
    X. Liu, Q. Chen, V. Sundaram, R.R. Tummala, S.K. Sitaraman, Microelectron. Reliab. 53, 70–78 (2013)CrossRefGoogle Scholar
  20. 20.
    S.K. Ryu, K.H. Lu, X. Zhang, J.H. Im, P.S. Ho, R. Huang, IEEE Trans. Device Mater. Reliab. 11, 35–43 (2011)CrossRefGoogle Scholar
  21. 21.
    A.El Amrani, K. Demir, M. Bouya, M. Faqir, A. Hadjoudja, M. Ghogho, Microelectron. Eng. 165, 6–10 (2016)CrossRefGoogle Scholar
  22. 22.
    K. Demir, A. Armutlulu, V. Sundaram, P. Markondeya Raj, R.R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 7, 829–837 (2017)CrossRefGoogle Scholar
  23. 23.
    K. Demir, T. Ogawa, V. Sundaram, P. Markondeya Raj, R. Tummala, IEEE Trans. Device Mater. Reliab. 17(4), 683–691 (2017)CrossRefGoogle Scholar
  24. 24.
    K. Demir, A. Benali, V. Sundaram, P. Markondeya Raj, R. Tummala, in Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th (IEEE, 2016), pp 799–805Google Scholar
  25. 25.
    Q. Chen, H. Lu, V. Sundaram, R.R. Tummala, IEEE Trans. Compon. Packag. Manuf. Technol. 5, 938–944 (2015)CrossRefGoogle Scholar
  26. 26.
    S.R. McCann, Y. Sato, V. Sundaram, R.R. Tummala, S.K. Sitaraman, In Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th (IEEE, 2015), pp 1938–1944Google Scholar
  27. 27.
    T.C. Lu, J. Yang, Z. Suo, A.G. Evans, R. Hecht, R. Mehrabian, Acta Metall. Mater. 39, 1883–1890 (1991)CrossRefGoogle Scholar
  28. 28.
    S. Nakamura, E. Pavlovic, E.J. Kramer, J. Adhes. 83, 351–365 (2007)CrossRefGoogle Scholar
  29. 29.
    W. Engelmaier, ASTM Special Technical Publication (ASTM International, Philadelphia, 1982), pp. 279–295Google Scholar
  30. 30.
    T. Huang, V. Sundaram, P. Markondeya Raj, H. Sharma, R. Tummala, in Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th (IEEE, 2014), pp 2266–2270Google Scholar

Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  • Kaya Demir
    • 1
  • Vijay Sukumaran
    • 1
  • Yoichiro Sato
    • 2
  • Abderrahim El Amrani
    • 3
  • Koushik Ramachandran
    • 1
  • Raghuram Pucha
    • 1
  • P. Markondeya Raj
    • 1
  • Venkatesh Sundaram
    • 1
  • Rao Tummala
    • 1
  1. 1.Packaging Research CenterGeorgia Institute of TechnologyAtlantaUSA
  2. 2.Asahi Glass Co.YokohamaJapan
  3. 3.Universite Internationale de RabatAl JadidaMorocco

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