Effect of nickel (Ni) on the growth rate of Cu6Sn5 intermetallic compounds between Sn–Cu–Bi solder and Cu substrate
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In this work, the lead-free composite solder was fabricated by mixing Ni element with Sn–0.7Cu–10Bi solder. The effect of nickel (Ni) addition on the growth behavior of intermetallic compounds (IMCs) between Sn–0.7Cu–10Bi–xNi (x = 0, 0.05, 0.10, 0.15 and 0.20, in wt%) solder and Cu substrate during the soldering process was studied. The microstructure and the IMCs growth of the solder joints under thermal aging were systematically investigated. The results shown that the addition of Ni element has a slightly influence on melting point of the solder. Moreover, the addition of Ni element can change Cu6Sn5 shape from scalloped-like structure into flat-like one. Moreover, the results reveal that Ni can considerably inhibit the growth and reduce the thickness of Cu6Sn5. The thickness of Cu6Sn5 ranges from 3.07 to 8.42 µm after aging process The diffusion coefficient (D) is 1.80 × 10−3 µm2 h−1 and growth rate (dH/dt) is 4.08 × 10−7 µm s−1 of the Cu6Sn5 when the Ni content come to 0.15 wt%. The (Cu,Ni)6Sn5 phase formed in the IMCs layer when Ni was added to the solder, and it can effectively hinder the diffusion of Cu atoms and depressed the growth rate of Cu6Sn5.
This work was supported by the Fundamental Research Funds for the Central Universities (2017XKQY004).