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Effect of Sn contents on thermodynamic, microstructure and mechanical properties in the Zn90–Bi10 and Bi88–Zn12 based ternary alloys

  • Pınar Ata Esener
  • Yemliha Altıntas
  • Ümit Bayram
  • Esra Öztürk
  • Necmettin Maraşlı
  • Sezen Aksöz
Article
  • 9 Downloads

Abstract

The thermal conductivity variations with temperature for Zn90 − x–Snx–Bi10 (x = 5,10, 40 and 85 wt%) and Bi88 − x–Snx–Zn12 (x = 1.39, 43.26 and 79.3 wt%) alloys were measured by using the linear heat flow method. From thermal conductivity–temperature plots, the coefficients of thermal conductivity for the Zn–Sn–Bi alloys were calculated. The microstructures of Zn–Sn–Bi alloys were observed using scanning electron microscopy (SEM). The existing phases into microstructure were identified energy dispersive X-ray (EDX) analysis. The melting temperatures, the enthalpy of fusion and specific heat change between the liquid and solid phases in the Zn–Sn–Bi alloys were determined from Differential Scanning Calorimetry (DSC) trace. The tensile strength and microhardness of the alloys were measured using a Shimadzu Universal Testing Instrument (Type AG-10 KNG) and Future-Tech FM-700 model microhardness device.

Notes

Acknowledgements

Nevşehir Hacı Bektaş Veli University Research Foundation was provided the funding of this study under Contract No: NEÜADP15F18. The researchers thank to the university for the support.

References

  1. 1.
    S.P. Yu, H.J. Lin, M.H. Hon, J. Mater. Sci. 11, 461–471 (2000)Google Scholar
  2. 2.
    F.A. El-Salam, R.H. Nada, A.M.A. El-Khalek, Mater. Sci. Eng. A 448, 171–176 (2007)CrossRefGoogle Scholar
  3. 3.
    K. Suganuma, K.S. Kim, J. Mater. Sci. 18, 121–127 (2007)Google Scholar
  4. 4.
    R.A. Islam, Y.C. Chan, W. Jillek, S. Islam, Microelectron. J. 37, 705–713 (2006)CrossRefGoogle Scholar
  5. 5.
    X. Chen, M. Li, X.X. Ren, A.M. Hu, D.L. Mao, J. Electron. Mater. 35(9), 1734–1739 (2006)CrossRefGoogle Scholar
  6. 6.
    C. Wei, Y.C. Liu, Y.J. Han, J.B. Wan, K. Yang, J. Alloys Compd. 464, 301–305 (2008)CrossRefGoogle Scholar
  7. 7.
    K.L. Lin, K.I. Chen, H.M. Hsu, C.L. Shi, Electron. Comp. Technol. Conf. Proc. 658–663 (2003)Google Scholar
  8. 8.
    K.J. Puttlitz, K.A. Stalter: Hand Book of Led-Free Solder Technology for Microelectronic Assemblies, (CRC Press, Boca Raton 2004), p. 2CrossRefGoogle Scholar
  9. 9.
  10. 10.
    W. Yang, R.W. Messler Jr., L.E. Felton, J.Electron. Mater. 23(8), 765–772 (1994)CrossRefGoogle Scholar
  11. 11.
    J. Vizdal, M. Helena-Braga, A. Kroupa, K.W. Richter, D. Soares, L.F. Malheiros, J. Ferreira, Calphad 31, 438–448 (2007)CrossRefGoogle Scholar
  12. 12.
    N. Maraşlı, J.D. Hunt, Acta Metall. 44, 1085–1096 (1996)Google Scholar
  13. 13.
    N. Aksöz, E. Öztürk, Ü Bayram, S. Aksöz, S. Kervan, A. Ülgen, N. Maraşlı, J. Electron. Mater. 42(12), 3573–3581 (2013)CrossRefGoogle Scholar
  14. 14.
    Y.S. Touloukian, R.W. Powell, C.Y. Ho, P.G. Klemens, Thermal Conductivity Metallic Elements and Alloys, vol. 1, (IFI/Plenum, New York, 1970), p. 17aCrossRefGoogle Scholar
  15. 15.
    C. Kittel, Introduction to Solid State Physics (Wiley, New York, 1965)Google Scholar
  16. 16.
    A. Aran, Manufacturing Properties of Engineering Materials Lecture Notes, ITU, Department of Mechanical Engineering, (2007)Google Scholar
  17. 17.
  18. 18.
    M. Okayasu, T. Muranaga, A. Endo, J. Sci. 2(1), 128–139 (2017)Google Scholar
  19. 19.
  20. 20.
  21. 21.
  22. 22.
    D. Roylance, Mechanical Properties of Materials, (MIT, Cambridge, 2008)Google Scholar
  23. 23.
    M.A. Maleque, M.S. Salit, Springer Briefs Mater., 1–15 (2013)Google Scholar
  24. 24.
    J.L. Mena-Tun, P.I. Gonzales-Chi, A. Diaz, Adv. Polym. Tech. 32 (S(1), E749–E759 (2013)CrossRefGoogle Scholar
  25. 25.
  26. 26.
    Y.S. Touloukian, R.W. Powell, C.Y. Ho, P.G. Klemens, Thermal Conductivity, Metallic Elements and Alloys, Thermophysical Properties of Matter. New York - Washington 1, 845 13a-25a, 49, 149, 185, 408, 498 (1970)Google Scholar
  27. 27.
    M.H. Braga, J. Vizdal, A. Kroupa, J. Ferreira, D. Soares, L.F. Malheiros, Calphad 31(4), 468–478 (2007)CrossRefGoogle Scholar
  28. 28.
    M. Hansen, Constitution of Binary Alloys (McGraw-Hill, New York, 1958)CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2019

Authors and Affiliations

  • Pınar Ata Esener
    • 1
  • Yemliha Altıntas
    • 2
  • Ümit Bayram
    • 3
  • Esra Öztürk
    • 4
  • Necmettin Maraşlı
    • 5
  • Sezen Aksöz
    • 6
  1. 1.Institute of Natural and Applied SciencesErciyes UniversityKayseriTurkey
  2. 2.Department of Materials Science and NanotechnologyAbdullah Gül UniversityKayseriTurkey
  3. 3.Department of Physics, Faculty of ScienceErciyes UniversityKayseriTurkey
  4. 4.Department of PhysicsKocaeli UniversityKocaeliTurkey
  5. 5.Department of Metallurgical and Materials EngineeringYıldız Technical UniversityIstanbulTurkey
  6. 6.Department of PhysicsNevşehir Hacı Bektaş Veli UniversityNevşehirTurkey

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