Graphene and carbon black filled conductive nanocomposite films for heating element applications
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Graphene has ultra-high electrical and thermal conductivity, which makes graphene as the most encouraging fillers for thermally conductive composites. Graphene and/or carbon black filled conductive polymer composite (CPC) films used as heating element are smarter than the traditional heating elements due to less environmental pollution, ease of application on many surfaces and possess the merits of lightweight. In this study, we investigated mainly the production, characterization and industrial application of graphene/carbon black reinforced styrene acrylic copolymer emulsion matrix composite films deposited on polyvinyl chloride for flexible heating element. After that, the films were dried at room temperature for 24 h in air. Structural and surface properties of the CPC films were characterized by X-ray diffraction and scanning electron microscopy. Temperature, time and voltage relation of the produced composite films were investigated. Heating and electrical properties of the CPC films were determined by using a thermal camera and 4-point probe measurement system, respectively. The electrical resistivity of the CPC films decreases from ~ 108 to 101 Ω cm with increasing the filler content or using a combination of two fillers. Graphene and carbon black filled conductive polymer composites to be considered as candidates for flexible heating element applications exhibited good electrical and heating properties thanks to synergistic effect of fillers.
The authors are indebted to State Planning Foundation (DPT, Grant Number 2009.K120600) and Dokuz Eylul University financial and infrastructural support for establishment of Dokuz Eylul University, Center for Fabrication and Applications of Electronic Materials (EMUM) where this research was carried out.
- 1.R. Zhang, J.C. Agar, C.P. Wong, Encyclopedia of Polymer Science and Technology, (John Wiley & Sons, Inc., Hoboken, 2011)Google Scholar
- 2.K. Müller, E. Bugnicourt, M. Latorre, M. Jorda, Y. Echegoyen Sanz, J.M. Lagaron, O. Miesbauer, A. Bianchin, S. Hankin, U. Bölz, G. Pérez, M. Jesdinszki, M. Lindner, Z. Scheuerer, S. Castelló, M. Schmid, Nanomaterial (Basel, Switzerland) 7, (2017)Google Scholar
- 4.M. Erol, E. Çelik, Mater. Tehnol. 47, 25 (2013)Google Scholar
- 6.P.V. Notingher, D. Panaitescu, H. Paven, M. Chipara, J. Optoelectron. Adv. Mater. 6, (2004)Google Scholar
- 9.A. Russameeden, J. Pumchusak, J. Met. Mater. Miner. 18, 121 (2008)Google Scholar
- 10.A.B. Kaiser, Y.W. Park, Synth. Met. pp. 181–184 (2005)Google Scholar
- 13.M. Yurddaskal, M. Erol, E. Celik, J. Mater. Sci. Mater. Electron. 28, (2017)Google Scholar
- 22.W. Zhang, A.A. Dehghani-Sanij, R.S. Blackburn, J. Mater. Sci., pp. 3408–3418 (2007)Google Scholar
- 32.K. Shahil, A. Balandin, ArXiv Prepr. ArXiv1201.0796 1 (2012)Google Scholar
- 41.M. Shtein, R. Nadiv, M. Buzaglo, K. Kahil, O. Regev, Chem. Mater. 08, 45 (2015)Google Scholar
- 49.J.F. Dai, G.J. Wang, L. Ma, C.K. Wu, Rev. Adv. Mater. Sci. 40, 60 (2015)Google Scholar