Effect of In addition on microstructure and mechanical properties of Sn–40Bi alloys
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The effect of In on melting property, microstructure and mechanical properties of Sn–40Bi–xIn (x = 0, 1, 2, 4, 6, 8 wt%, respectively) alloys was investigated by means of differential scanning calorimetry, scanning electron microscope, X-ray diffraction and tensile test. The results show that the solidus temperature and the liquidus temperature decrease with the increase in In content. The 1In, 2In and 4In alloys are composed of Sn–Bi eutectic and β–Sn dendrites with In atoms dissolved, whereas 6In and 8In alloys composed of Sn–Bi eutectics, BiIn–Sn metastable phases, Bi particles and primary β–Sn phases. At room temperature, 6In exhibits the maximum ultimate tensile strength of 77 MPa, while 4In displays a more outstanding elongation rate of 42%. Moreover, 2In alloy exhibits an even outstanding elongation behavior (above 300%) at temperatures of 100 and 120 °C.
This work was supported by the National Natural Science Foundation of China (Grant Nos. 51541104, 51402132) and Jiangsu Planning Project of Science and Technology (Grant No. BK20150466).
- 13.Ribas M, Hunsinger T, Cucu T, Ramakrishna HV, Lim G, Murphy M (2018) The printed circuit assembler’s guide to low-temperature soldering. BR Publishing, Inc., New DelhiGoogle Scholar
- 14.Aspandiar R, Byrd K, Tang KK, Campbell L, Mokler S (2015) Investigation of low-temperature solders to reduce reflow temperature, improve SMT yields and realize energy savings. IPC APEX EXPO, San Diego, California. FebruaryGoogle Scholar
- 16.Chen OH, Molina A, Aspandiar R, Byrd K, Mokler S, Tang KK (2015) Mechanical shock and drop reliability evaluation of the BGA solder joint stack-ups formed by reflow soldering SAC solder balls BGAs with BiSnAg and resin reinforced BiSn-Based solder pastes. In: SMTA international conference and exhibition. Rosemont, Illinois. SeptemberGoogle Scholar
- 17.Sidhu RS, Renavikar MP, Dani AA, Dudek MA (2014) Solder paste material technology for elimination of high warpage surface mount assembly defects. U.S. Patent, 0175160 A1Google Scholar
- 18.Mokler S, Aspandiar R, Byrd K, Chen O, Walwadkar S, Tang KK, Renavikar M, Sane S (2016) The application of Bi-based solders for low-temperature reflow to reduce cost while improving SMT yields in client computing systems. In: SMTA international conference and exhibition, Rosemont, Illinois. SeptemberGoogle Scholar
- 24.Lai Z, Ye D (2016) Microstructure and fracture behavior of non eutectic Sn–Bi solder alloys. J Mater Sc: Mater Electron 27:1–10Google Scholar
- 26.Wang XJ, Zhu QS, Liu B, Liu N, Wang FJ (2014) Effect of doping Al on the liquid oxidation of Sn–Bi–Zn solder. J Mater Sci: Mater Electron 25:2297–2304Google Scholar
- 31.Wu C, Shen J, Peng C (2012) Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints. J Mater Sci: Mater Electron 23(1):14–21Google Scholar
- 33.Takao H, Yamada A, Hasegawa H (2004) Mechanical properties and solder joint reliability of low-melting Sn–Bi–Cu lead free solder alloy. R&D Rev Toyota CRDL 39(2):41Google Scholar
- 34.Wu XL, Xia M, Li SJ, Wang XJ, Liu B, Zhang JX, Liu N (2017) Microstructure and mechanical behavior of Sn–40Bi-x Cu alloy. J Mater Sci: Mater Electron 28(20):15708–15717Google Scholar
- 38.Shen J, Wu C, Li S (2012) Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys. J Mater Sci: Mater Electron 23:156–163Google Scholar