Journal of Materials Science

, Volume 44, Issue 4, pp 1076–1081 | Cite as

Synthesis and electrical properties of uniform silver nanoparticles for electronic applications

  • Dapeng Chen
  • Xueliang QiaoEmail author
  • Xiaolin Qiu
  • Jianguo Chen


Silver nanoparticles are considered to apply a silver paste for electrode because of their high conductivity. However, the dispersion of silver nanoparticles in electronically conductive adhesives (ECAs) restricts them used as conductive fillers. A simple method had enabled the synthesis of silver nanoparticles by reducing silver nitrate with ethanol in the presence of poly(N-vinylpyrrolidone) (PVP). Reaction conditions, such as silver nitrate concentration, PVP concentration, reaction time, and reaction temperature, had been studied. Fine dispersion and narrow size distribution of silver nanoparticles were obtained. They were added to ECAs by re-dispersing them in ethanol while it was used as the diluent to adjust the volatility of ECAs, preventing them from the aggregation and increasing the chance to fill the gaps between silver flakes. This proposed process offers the possibility to effectively use these synthesized silver nanoparticles for improving the conductivity of ECAs.


Silver Nanoparticles Silver Nitrate Narrow Size Distribution Fine Dispersion Conductive Filler 



The authors would like to thank Analytical and Testing Center, Huazhong University of Science and Technology, P.R. China, for the test of TEM images. The authors wish to thank Dr. Changle Wu and Dr. Wei Wang for discussions and their valuable advices.


  1. 1.
    Balan L, Malval JP, Schneider R, Burget D (2007) Mater Chem Phys 104:417CrossRefGoogle Scholar
  2. 2.
    Jiang ZJ, Liu CY, Sun LW (2005) J Phys Chem B 109:1730CrossRefGoogle Scholar
  3. 3.
    Hsu SLC, Wu RT (2007) Mater Lett 61:3719CrossRefGoogle Scholar
  4. 4.
    Park S, Seo D, Lee J (2008) Colloids Surf A Physicochem Eng Asp 313–314:197CrossRefGoogle Scholar
  5. 5.
    Morones JR, Elechiguerra JL, Camacho A, Holt K, Kouri JB, Ramirez JT, Yacaman MJ (2005) Nanotechnology 16:2346CrossRefGoogle Scholar
  6. 6.
    Martinez-Castanon GA, Nino-Martinez N, Martinez-Gutierrez F, Martinez-Mendoza JR, Ruiz F (2008) J Nanopart Res 10:1343CrossRefGoogle Scholar
  7. 7.
    Shiraishi Y, Toshima N (1999) J Mol Catal A Chem 141:187CrossRefGoogle Scholar
  8. 8.
    McFarland AD, VanDuyne RP (2003) Nano Lett 3:1057CrossRefGoogle Scholar
  9. 9.
    Castro T, Reifenberger R, Choi E, Andres RP (1990) Phys Rev B 42:8548CrossRefGoogle Scholar
  10. 10.
    Pothukuchi S, Li Y, Wong CP (2004) J Appl Polym Sci 93:1531CrossRefGoogle Scholar
  11. 11.
    Slistan-Grijalva A, Herrera-Urbina R, Rivas-Silva JF, Avalos-Borja M, Castillon-Barraza FF, Posada-Amarillas A (2008) Mater Res Bull 43:90CrossRefGoogle Scholar
  12. 12.
    Khanna PK, Kulkarni D, Beri RK (2008) J Nanopart Res 10:1059CrossRefGoogle Scholar
  13. 13.
    Malandrino G, Finocchiaro ST, Fragala IL (2004) J Mater Chem 14:2726CrossRefGoogle Scholar
  14. 14.
    Behrens S, Wu J, Habicht W, Unger E (2004) Chem Mater 16:3085CrossRefGoogle Scholar
  15. 15.
    Yin BS, Ma HY, Wang SY, Chen SH (2003) J Phys Chem B 107:8898CrossRefGoogle Scholar
  16. 16.
    Kim KD, Choi KY, Kim HT (2005) Scr Mater 53:571CrossRefGoogle Scholar
  17. 17.
    Shchukin DG, Radtchenko IL, Sukhorukov GB (2003) Chemphyschem 4:1101CrossRefGoogle Scholar
  18. 18.
    Jin RC, Cao YW, Mirkin CA (2001) Science 294:1901CrossRefGoogle Scholar
  19. 19.
    Yamamoto T, Yin H, Wada YJ (2004) Bull Chem Soc Jpn 77:757CrossRefGoogle Scholar
  20. 20.
    Oliveira MM, Zanchet D, Ugarte D, Zarbin AJG (2004) Prog Colloid Polym Sci 128:126Google Scholar
  21. 21.
    Sun YG, Xia YN (2002) Science 298:2176CrossRefGoogle Scholar
  22. 22.
    Caswell KK, Bender CM, Murphy CJ (2003) Nano Lett 3:667CrossRefGoogle Scholar
  23. 23.
    Jiang XC, Zeng QH, Yu AB (2007) Langmuir 23:2218CrossRefGoogle Scholar
  24. 24.
    Carotenuto G, Pepe GP, Nicolais L (2000) Eur Phys J B 16:11CrossRefGoogle Scholar
  25. 25.
    Zhang ZT, Zhao B, Hu LM (1996) J Solid State Chem 121:105CrossRefGoogle Scholar
  26. 26.
    Linnert T, Mulvaney P, Henglein A, WeUer H (1990) J Am Chem Soc 112:4657CrossRefGoogle Scholar
  27. 27.
    Joerger R, Klaus T, Granqvist CG (2000) Adv Mater 12:407CrossRefGoogle Scholar
  28. 28.
    Lu DQ, Wong CP (2000) IEEE Trans Electron Packag Manuf 23:185CrossRefGoogle Scholar
  29. 29.
    Lee HH, Chou KS, Shih ZW (2005) Int J Adhes Adhes 25:437CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  • Dapeng Chen
    • 1
  • Xueliang Qiao
    • 1
    Email author
  • Xiaolin Qiu
    • 2
  • Jianguo Chen
    • 1
  1. 1.State Key Laboratory of Plastic Forming Simulation and Die and Mould TechnologyHuazhong University of Science and TechnologyWuhanPeople’s Republic of China
  2. 2.Nanomaterials Research CenterNanchang Institute of TechnologyNanchangPeople’s Republic of China

Personalised recommendations