Electroless copper deposition on aluminum-seeded ABS plastics
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We report a method of converting non-conductive plastic surfaces into conductive by coating either aluminum or aluminum-carbon black containing enamel pastes onto acrylonitrile-butadiene-styrene (ABS) plastics to create aluminum-seeded surfaces for a subsequent copper deposition. Through a simple electroless procedure, copper ions were reduced on the Al seeds and deposited on the ABS surface to develop a conductive layer in about 10-min deposition time. We demonstrate that addition of carbon black particles to the pastes shorten the time to reach the maximum conductivity and enhance the adhesion of electrolessly deposited copper layer to the ABS substrate surface. The electroless copper deposition process developed in this study may open up a new route of plating on plastics (POP) for printed circuit boards, electromagnetic interference shielding, and many other applications.
KeywordsDeposition Time Electroless Plating Carbon Black Particle Electroless Deposition Longe Deposition Time
The authors are grateful to Mr. Bernard Nolan, the electrical engineer of Advanced Technology and Manufacturing at the University of Massachusetts – Dartmouth for technical support.
- 1.Kuzmik JJ (1990) In: Mallory GO, Hajdu JB (eds) Electroless plating: fundamentals and applications (Reprint Edition). The American Electroplaters and Surface Finishers Society, pp 377–399Google Scholar
- 3.Viswanathan B (1993) Metallization of plastics by electroless plating. Curr Sci 65(7):537Google Scholar
- 4.Deckert CA (1995) Electroless copper plating - a review. 1. Plat Surf Finish 82(2):48Google Scholar
- 5.Deckert CA (1995) Electroless copper plating - a review. 2. Plat Surf Finish 82(3):58Google Scholar
- 7.Hudd AB, Bentley P, Fox J, Robinson M (2006) Method of forming a conductive metal region on a substrate. US Patent 20060134318 (pending)Google Scholar
- 8.Radovsky DA, Ronkese B J et al (1963) Method of electroplating on a dielectric base. US Patent 3,099,608Google Scholar
- 14.Mansukhani IR (1980) Plating of substrates by jet printing. US Patent 4,242,369Google Scholar