Journal of Materials Science

, Volume 43, Issue 6, pp 1749–1756 | Cite as

Mechanical testing of titanium/aluminium–silicon interfaces by push-out

  • Olivier DezellusEmail author
  • Lucile Milani
  • Françoise Bosselet
  • Myriam Sacerdote-Peronnet
  • Dominique Rouby
  • Jean-Claude Viala


Mechanical properties of Ti/Al–7Si assemblies produced by insert moulding were studied with a classical push-out test and a variant that is the circular-bending test. Special care has been taken for controlling both the reactivity at the Ti/Al–7Si interface and the metallurgical health of the Al–7Si matrix. Mechanical tests until complete debonding have been completed with interrupted tests, metallographic characterizations and FEM analysis of elastic stress state. A mean shear strength of the interface of about 120 MPa was obtained. When the Ti insert is solely fretted in the matrix, without chemical interaction between Ti and the Al–7Si alloy, the mean shear strength is significantly lower (48 MPa). This result clearly shows that chemical interaction at the interface (formation of a thin TiSi layer at the Ti side and a thick Al3Ti(Si) layer at the Al–7Si alloy side) improves the mechanical properties of the assembly. It is also shown that the failure sequence is characterized both by crack propagation from bottom to top and matrix yielding from top to bottom. Actually, interface damaging begins by crack initiation at the specimen bottom face (not at the top face and under the indenter) in a nearly pure mode I solicitation at a radial tensile stress of about 100 MPa.


Acoustic Emission Crack Initiation Al3Ti Acoustic Emission Event Pure Mode 


  1. 1.
    Clyne TW, Whiters PJ (1993) An introduction to metal matrix composites. Cambridge University Press, CambridgeCrossRefGoogle Scholar
  2. 2.
    Durrant G, Gallernault B, Cantor B (1996) J Mater Sci 31:589CrossRefGoogle Scholar
  3. 3.
    Viala JC, Peronnet M, Barbeau F, Bosselet F, Bouix J (2002) Compos Part A 33A:1417CrossRefGoogle Scholar
  4. 4.
    Viala JC, Peillon N, Bosselet F, Bouix J (1997) Mater Sci Eng A 229A:95CrossRefGoogle Scholar
  5. 5.
    Barbeau F, Peronnet M, Bosselet F, Viala JC, Paty F, Loussault JG (2001) French Patent Application N°2 803 783, July 7, 2001, European Patent N°1 118 457, July 25, 2001Google Scholar
  6. 6.
    Dezellus O, Digonnet B, Sacerdote-Peronnet M, Bosselet F, Rouby D, Viala JC (2007) Int J Adhes Adhes 27:417CrossRefGoogle Scholar
  7. 7.
    Sacerdote-Peronnet M, Guiot E, Bosselet F, Dezellus O, Rouby D, Viala JC (2007) Mater Sci Eng A 445–446A:296CrossRefGoogle Scholar
  8. 8.
    Redston GD, Stanworth JE (1946) J Soc Glass Technol 30:201Google Scholar
  9. 9.
    Peronnet M, Barbeau F, Bosselet F, Viala JC, Bouix J (1999) J Phys IV 9:Pr4/223Google Scholar
  10. 10.
    Norby P, Christensen AN (1986) Acta Chem Scand Ser A 40A:157CrossRefGoogle Scholar
  11. 11.
    Shob O, Nowotny H, Benezovsky F (1962) Plansee Pulvermet 10:67Google Scholar
  12. 12.
    Leguillon D (2001) C R Acad Sci Paris 329:97Google Scholar
  13. 13.
    Kallas MN, Koss DA, Hahn HT, Hellmann JR (1992) J Mater Sci 27:3821CrossRefGoogle Scholar
  14. 14.
    Galbraith JM, Rhyne EP, Koss DA, Hellmann JR (1996) Scripta Mater 35:543CrossRefGoogle Scholar
  15. 15.
    Majumdar BS, Miracle DB (1996) Key Eng Mater 116–117:153Google Scholar
  16. 16.
    Evans AG, Ruhle M, Dalgleish BJ, Charalambides PG (1990) Metall Trans A 21A:2419CrossRefGoogle Scholar
  17. 17.
    Cao HC, Evans AG (1989) Mech Mater 7:295CrossRefGoogle Scholar
  18. 18.
    O’Dowd NP, Stout MG, Shih CF (1992) Phil Mag A 66A:1037CrossRefGoogle Scholar
  19. 19.
    Chandra N, Ghonem H (2001) Compos Part A 32A:575CrossRefGoogle Scholar
  20. 20.
    Kerans RJ (1991) J Am Ceram Soc 74:1585CrossRefGoogle Scholar
  21. 21.
    Marshal DB (1992) Acta Metall Mat 40:427CrossRefGoogle Scholar
  22. 22.
    Koss DA, Petrich RR, Kallas MN, Hellmann JR (1994) Compos Sci Technol 51:27CrossRefGoogle Scholar
  23. 23.
    Brillet-Rouxel H, Arfan E, Leguillon D, Dupeux M, Braccini M, Orain S (2006) Microelectron Eng 83:2297CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2008

Authors and Affiliations

  • Olivier Dezellus
    • 1
    Email author
  • Lucile Milani
    • 1
  • Françoise Bosselet
    • 1
  • Myriam Sacerdote-Peronnet
    • 1
  • Dominique Rouby
    • 2
  • Jean-Claude Viala
    • 1
  1. 1.Université Claude Bernard Lyon 1, LMI – UMR CNRS No 5615Villeurbanne CedexFrance
  2. 2.INSA-Lyon, GEMPPM – UMR CNRS No 5510Villeurbanne CedexFrance

Personalised recommendations