Journal of Materials Science

, Volume 42, Issue 18, pp 7729–7737 | Cite as

Numerical simulation of rapid solidification of a spherical sample on a metallic substrate

  • Zoran S. NikolicEmail author
  • Masahiro Yoshimura


Since the exact analytical solutions for rapid solidification process are available only for special boundary conditions, numerical techniques have to be applied for more general boundary conditions. In this paper we will describe a finite difference method for simulation of rapid solidification that is based on control volume methodology and interface-tracking technique. Heat transfer computer study will be realized for solidification with and without melt undercooling at the interface. Such numerical method will be applied for thermal history analysis of solidifying nickel on copper substrate.


Heat Transfer Coefficient Interface Velocity Nucleation Temperature Interfacial Heat Transfer Coefficient Spherical Sample 



The first author would like to thank the Japan Society for the Promotion of Science (Invitation Fellowship No. L-06544).


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Copyright information

© Springer Science+Business Media, LLC 2007

Authors and Affiliations

  1. 1.Faculty of Electronic Engineering, Department of MicroelectronicsUniversity of NishNishSerbia
  2. 2.Materials and Structure Laboratory, Center for Materials DesignTokyo Institute of TechnologyYokohamaJapan

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