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Journal of Materials Science

, Volume 42, Issue 8, pp 2574–2581 | Cite as

Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

  • Po-Cheng ShihEmail author
  • Kwang-Lung Lin
Article

Abstract

Sn–8Zn–3Bi solder paste was applied as a medium to joint Sn–3.2Ag–0.5Cu solder balls and Cu/Ni/Au metallized ball grid array substrates at 210 °C. Sn–Ag–Cu joints without Sn–Zn–Bi addition were also conducted for comparison. The shear behavior of the specimens was investigated after multiple reflow and thermal aging. For each strength test, more than 40 solder balls were sheared. The shear strength of Sn–Ag–Cu specimens kept constant ranging from 15.5 ± 1.3 N (single reflow) to 16.2 ± 1.0 N (ten reflows) and the fractures occurred in the solder. Shear strength of Sn–Ag–Cu/Sn–Zn–Bi specimens fell from 15.9 ± 1.7 N (single reflow) to 13.4 ± 1.6 N (ten reflows). After single reflow, Sn–Ag–Cu/Sn–Zn–Bi specimens fractured in the solder along Ag–Au–Cu–Zn intermetallic compounds and at Ni metallization. After ten reflows, fractures occurred in the solder and at solder/Ni–Sn–Cu–Zn intermetallic compound interface. The shear strengths of the Sn–Ag–Cu and Sn–Ag–Cu/Sn–Zn–Bi packages changed little after aging at 150 °C. Sn–Ag–Cu/Sn–Zn–Bi joints kept higher strength than Sn–Ag–Cu joints. Sn–Ag–Cu joints fractured in the solder after aging. But the fractures of Sn–Ag–Cu/Sn–Zn–Bi specimens shifted to the solder with aging time.

Keywords

Shear Strength Solder Ball Ball Grid Array Molten Solder Eutectic Solder 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgements

Financial support for this work provided by the National Science Council of R.O.C. (Taiwan) under grant NSC91-2216-E-006-035 is gratefully acknowledged. The authors also thank Accurus Scientific Co., LTD. for supplying the solder balls.

References

  1. 1.
    Amagai M, Watanabe M, Omiya M, Kishimoto K, Shibuya T (2002) Microelectron Reliab 42:951CrossRefGoogle Scholar
  2. 2.
    Hirose A, Fujii T, Imamura T, Kobayashi KF (2001) Mater Trans 42(5):794CrossRefGoogle Scholar
  3. 3.
    Miyazawa Y, Ariga T (2001) Mater Trans 42(5):776CrossRefGoogle Scholar
  4. 4.
    Chonan Y, Komiyama T, Onuki J, Urao R, Kimura T, Nagano T (2002) Mater Trans 43(8):1887CrossRefGoogle Scholar
  5. 5.
    Chuang CM, Shih PC, Lin KL (2004) J Electron Mater 33(1):1CrossRefGoogle Scholar
  6. 6.
    Choi JW, Cha HS, Oh TS (2002) Mater Trans 43(8):1864CrossRefGoogle Scholar
  7. 7.
    Jang JW, Frear DR, Lee TY, Tu KN (2000) J Appl Phys 88(11):6359CrossRefGoogle Scholar
  8. 8.
    Bradley E III, Hranisavljevic J (2000). In: Electronic components and technology conference, 2000 proceedings 50th, 21–24 May 2000, p 1443Google Scholar
  9. 9.
    Vianco PT, Rejent JA (1999) J Electron Mater 28(11):1127CrossRefGoogle Scholar
  10. 10.
    Vianco PT, Rejent JA (1999) J Electron Mater 28(11):1138CrossRefGoogle Scholar
  11. 11.
    Kariya Y, Otsuka M (1998) J Electron Mater 27(7):866CrossRefGoogle Scholar
  12. 12.
    Kang SK, Choi WK, Shih DY, Lauro P, Henderson DW, Gosselin T, Leonard DN (2002) In: Electronic components and technology conference, 2002 proceedings 52nd, 28–31 May 2002, p 146Google Scholar
  13. 13.
    Lee CB, Jung SB, Shin YE, Shur CC (2002) Mater Trans 43(8):1858CrossRefGoogle Scholar
  14. 14.
    Kim SW, Yoon JW, Jung SB (2004) J Electron Mater 33(10):1182CrossRefGoogle Scholar
  15. 15.
    Ghosh G (2004) J Electron Mater 33(10):1080CrossRefGoogle Scholar
  16. 16.
    Lin YL, Luo WC, Lin YH, Ho CE, Kao CR (2004) J Electron Mater 33(10):1092CrossRefGoogle Scholar
  17. 17.
    Jang GY, Huang CS, Hsiao LY, Duh JG, Takahashi H (2004) J Electron Mater 33(10):1118CrossRefGoogle Scholar
  18. 18.
    Massalski TB (1986) Binary alloy phase diagrams, vol. 1. ASM, Metals Park, Ohio, USA, pp 85–86Google Scholar
  19. 19.
    Massalski TB (1986) Binary alloy phase diagrams, vol. 1. ASM, Metals Park, Ohio, USA, pp 69–71Google Scholar
  20. 20.
    Massalski TB (1986) Binary alloy phase diagrams, vol. 1. ASM, Metals Park, Ohio, USA, pp 540–541Google Scholar
  21. 21.
    Nishiura M, Nakayama A, Sakatani S, Kohara Y, Uenishi K, Kobayashi KF (2002) Mater Trans 43(8):1802CrossRefGoogle Scholar
  22. 22.
    Shimokawa H, Soga T, Serizawa K (2002) Mater Trans 43(8):1808CrossRefGoogle Scholar
  23. 23.
    Islam RA, Wu BY, Alam MO, Chan YC, Jillek W (2005) J Alloys Comp 392:149CrossRefGoogle Scholar
  24. 24.
    Coyle RJ, Solan PP, Serafino AJ, Gahr SA (2000) In: electronic components and technology conference, 2000 proceedings 50th, 21–24 May 2000, p 160Google Scholar

Copyright information

© Springer Science+Business Media, LLC 2006

Authors and Affiliations

  1. 1.Department of Materials Science and EngineeringNational Cheng-Kung UniversityTainanTaiwan, R.O.C.

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