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Journal of Materials Science

, Volume 42, Issue 15, pp 6004–6010 | Cite as

Thermoelectric properties of the welded Cu/Bi0.88 Sb0.12 /Cu composites in the temperature region from 193 K to 298 K

  • Hirotaka Odahara
  • Satoru Hiki
  • Osamu YamashitaEmail author
  • Sunao Sugihara
Article
  • 61 Downloads

Abstract

The resultant thermoelectric properties of Cu/T/Cu composites welded with \({\hbox{T}=\hbox{Bi}_{0.88}\hbox{Sb}_{0.12}}\) alloy were measured in the temperature range from T = 193 K to 298 K and compared with those calculated as a function of x by treating these composites as an electrical and thermal circuit, where x is the ratio of thickness of Bi–Sb alloy to the interval between two thermocouples. Consequently, the resultant electrical resistivities ρ of composites coincided closely with the calculated ρ values as a function of x, while the resultant Seebeck coefficients α were enhanced significantly in the range from x=0.076 to 0.61. In the x range from 0.16 to 1.0, the x-dependence of the resultant thermoelectric power factor P was found to be explained roughly at every temperature by the simple model proposed here when an enhancement factor in α was taken into the calculation. However, the maximum resultant P appeared at a small x of 0.076. The resultant P at x = 0.076 increases with a decrease of T and reached a surprisingly great value of 128.3 mW/K2 m at 193 K, which is 15.5 times larger than 8.29 mW/K2 m obtained for Bi0.88Sb0.12 alloy. On the other hand, its resultant ZT also increases monotonically with a decrease of T and has a great value of 0.54 at 193 K, which is 31% higher than 0.41 at 193 K for Bi–Sb alloy. The significant enhancement in the resultants P and ZT at low temperatures is owing predominantly to the increase in α due to the boundary effect.

Keywords

Electrical Resistivity Seebeck Coefficient Boundary Effect Thermoelectric Material Thermoelectric Generator 

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Copyright information

© Springer Science+Business Media, LLC 2007

Authors and Affiliations

  • Hirotaka Odahara
    • 1
  • Satoru Hiki
    • 2
  • Osamu Yamashita
    • 1
    Email author
  • Sunao Sugihara
    • 2
  1. 1.Faculty of EngineeringEhime UniversityBunkyocho, MatsuyamaJapan
  2. 2.Department of Materials Science and Ceramic TechnologyShonan Institute of TechnologyFujisawaJapan

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