Journal of Materials Science

, Volume 42, Issue 19, pp 8363–8369 | Cite as

The effect of curing conditions and ageing on the thermo-mechanical properties of polyimide and polyimide–silica hybrids

  • Ahmad Ali M. AliEmail author
  • Z. Ahmad


The effect of curing conditions and ageing on the thermo-mechanical properties of polyimide and its ceramers has been studied. Polyamic acid (PAA), a polyimide precursor, was prepared by the well known reaction of pyromellitic dianhydride and oxydianiline in dimethylacetamide as solvent. The silica network was developed in PAA solution by hydrolysis and condensation of tetraethoxysilane. The pure PAA films and those with 25 wt% silica content were imidized by six different curing protocols involving both step-wise and isothermal heatings. The dynamic mechanical thermal (DMTA) and thermal mechanical analyses (TMA) were performed on the pure and ceramer films cured under the different imidization conditions. The data for the mechanical properties were obtained for the same films left over for a year. The variations of storage and loss moduli and the glass transition temperature associated with α-relaxation and the linear thermal expansion coefficient have been explained in terms of degree of imidization and the effect of silica network densification under different conditions as a result of imidization and ageing.


Polyimide Storage Modulus DMAc Hybrid Film Silica Network 



It is a pleasure to acknowledge the financial support provided by Kuwait University under Project No. SC 07/01 and SAF program Project No. GS 01/01 for this research work.


  1. 1.
    Wang S, Ahmad Z, Mark JE (1994) Chem Mater 6:943CrossRefGoogle Scholar
  2. 2.
    Ahmad Z (2001) In: Buschaw KHJ (ed) The encyclopedia of materials: science and technology. Elsevier Science, Amsterdam, p 1086, Section: 5, Chapter 10Google Scholar
  3. 3.
    Ahmad Z, Mark JE (2001) Chem Mater 13:3320CrossRefGoogle Scholar
  4. 4.
    Imai Y, Nemoto H, Kakimoto MA (1996) J Polym Sci Part A Chem 34:701CrossRefGoogle Scholar
  5. 5.
    Kishanprasad VS, Gedam PH (1993) J Appl Polym Sci 50:419CrossRefGoogle Scholar
  6. 6.
    Rabilloud G (ed) (2000) High performance polymers, vol 3: Polyimides in electronics. Technip, ParisGoogle Scholar
  7. 7.
    Ghosh MK, Mittal KL (eds) (1996) Polyimides: fundamentals and applications. Marcel Dekker, New YorkGoogle Scholar
  8. 8.
    Lewis DA, Summers JD, Ward TC, McGrath JE (1992) J Polym Sci Part A Chem 30:1647CrossRefGoogle Scholar
  9. 9.
    Kook HJ, Kim D (2000) J Mater Sci 35:2949CrossRefGoogle Scholar
  10. 10.
    Tong K, Palathadka PK, Vora R (2002) Plastics, Rubber, Compos 31:191CrossRefGoogle Scholar
  11. 11.
    Lee YK, Muraraka SP (1998) J Mater Sci 33:5423CrossRefGoogle Scholar
  12. 12.
    Kim S, Kim H, Park J (1997) Polym J 30:229CrossRefGoogle Scholar
  13. 13.
    Morikawa A, Iyoku Y, Kakimoto M, Imai Y, Atsushi M, Yoshitake L, Yoshio I (1992) J Mater Chem 2:679CrossRefGoogle Scholar
  14. 14.
    Hsiue G, Chen J, Liu Y (2000) J Appl Polym Sci 76:1609CrossRefGoogle Scholar
  15. 15.
    Kita H, Saiki H, Tanaka K, Okamoto K (1995) J Photopolym Sci Technol 8:315CrossRefGoogle Scholar
  16. 16.
    Kang SJ, Kim D-J, Lee J-H, Choi SK, Kim HK (1996) Mol Cryst Liq Cryst Sci 280:277CrossRefGoogle Scholar
  17. 17.
    Kioul A, Mascia L (1994) J Non-Cryst Solids 175:169CrossRefGoogle Scholar
  18. 18.
    Brinker CJ, Scherer GW (eds) (1990) Sol–gel science. Academic Press, New YorkGoogle Scholar
  19. 19.
    Ahmad Z , Mark JE (1998) Mater Sci Eng C6:183CrossRefGoogle Scholar
  20. 20.
    Southward RE, Thomson DS, Thornton TA, Thompson DW, St Clair AK (1998) Chem Mater 10:486CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2007

Authors and Affiliations

  1. 1.Department of ChemistryKuwait UniversitySafatKuwait

Personalised recommendations