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Journal of Applied Electrochemistry

, Volume 49, Issue 10, pp 1043–1054 | Cite as

The influence of current density and bath temperature on electrodeposition of rhodium film from sulfate–phosphate aqueous solutions

  • Wangping WuEmail author
  • Jianwen Liu
  • Yue ZhangEmail author
  • Xiang Wang
  • Yi ZhangEmail author
Research Article
  • 21 Downloads
Part of the following topical collections:
  1. Electrodeposition

Abstract

Rhodium films were electrodeposited galvanostatically on copper–zinc alloy substrates from sulfate–phosphate aqueous solutions, in order to obtain a smooth, dense, and thick Rh film for electrical contacts. The influence of current density and bath temperature on phases, crystal structure, microstructure, and deposition rate of the film was studied. The phases and crystal structure, as well as microstructure of the film were determined by X-ray diffraction and scanning electron microscopy, respectively. The results showed that the current density and bath temperature had a significant influence on electrodeposition of rhodium film. The particles or aggregates on the surface evolved from fine to coarse and large with the increase of current density and bath temperature. By adjusting the deposition conditions, the optimized current density and bath temperature were 6.4–12.7 mA cm−2 and 50 °C, respectively. The film was composed of polycrystalline phase with monometallic form. The film was uniform and dense at low current density. The thickness of the film was up to 1.38–2.1 μm. At the optimal temperature of 50 °C, the surface of the film was smooth and fine. At the same time, the electrodeposition mechanism of the film was discussed.

Graphic abstract

Rhodium films were electrodeposited from sulfate–phosphate aqueous solutions. The influence of current density and bath temperature on electrodeposition of the film was studied, and at the same time, the electrodeposition mechanism of the film was addressed.

Keywords

Electrodeposition Rhodium film Current density Bath temperature 

Notes

Acknowledgements

The authors wish to thank Mr. Jiefa Shen from Department of Biochemical Engineering, School of Pharmaceutical Engineering & Life Science, Changzhou University for the preparation of rhodium electrodeposition solution and Dr. Fred Edmond BOAFO from School of Energy Systems Engineering, Kongju National University for their help in English language of this manuscript. This work has been partially supported by the National Natural Science Foundation of China (Grant Number: 51875053) and the Funding of Changzhou high technology research key laboratory of mould advanced manufacturing (Grant Number: CM20173001). Dr. Wangping Wu also thanks Ph. D student—Mr. Näther Johannes from Hochschule Mittweida University of Applied Sciences to provide one important reference book—‘Electrodeposition of the precious metals: osmium, iridium, rhodium, rhenium, ruthenium,’ and at the same time thanks the China Scholarship Council (CSC) an “Agreement for Study Abroad for CSC Sponsored Chinese Citizens” awarded a scholarship under the State Scholarship Fund to pursue study in Germany as a Visiting Scholar.

Compliance with ethical standards

Conflict of interest

We declare that we do not have any commercial or associative interest that represents a conflict of interest in connection with the work submitted.

References

  1. 1.
    Weisberg AM (1999) Rhodium plating. Met Finish 97(1):297–301.  https://doi.org/10.1016/S0026-0576(00)80337-2 CrossRefGoogle Scholar
  2. 2.
    Fink CG, Lambros GC (1933) Rhodium plating. Trans Electrochem Soc 63(1):181–186.  https://doi.org/10.1149/1.3493809 CrossRefGoogle Scholar
  3. 3.
    Son SH, Lee HK, Park SC (2010) Kinetics of rhodium electrodeposition for semiconductor interconnect applications. Surf Interface Anal 42(6–7):1244–1246.  https://doi.org/10.1002/sia.3288 CrossRefGoogle Scholar
  4. 4.
    Pushpavanam M, Raman V, Shenoi BA (1981) Rhodium-electrodeposition and applications. Surf Technol 12(4):351–360.  https://doi.org/10.1016/0376-4583(81)90029-7 CrossRefGoogle Scholar
  5. 5.
    Angus HC (1965) Electrodeposition of rhodium and ruthenium for slip-ring surfaces. Trans IMF 43(1):135–142.  https://doi.org/10.1080/00202967.1965.11869966 CrossRefGoogle Scholar
  6. 6.
    Shao I, Cotte JM, Haran B, Topol AW, Simonyi EE, Cabral C, Deligianni H (2007) An alternative low resistance MOL technology with electroplated rhodium as contact plugs for 32 nm CMOS and beyond. In: 2007 IEEE international interconnect technology conference. IEEE.  https://doi.org/10.1109/IITC.2007.382360
  7. 7.
    Marot L, Temmerman GD, Oelhafen P, Covarel G, Litnovsky A (2007) Rhodium coated mirrors deposited by magnetron sputtering for fusion applications. Rev Sci Instrum 78(10):103507-1–103507-7.  https://doi.org/10.1063/1.2800779 CrossRefGoogle Scholar
  8. 8.
    Marot L, DeTemmerman G, Thommen V, Mathys D, Oelhafen P (2008) Characterization of magnetron sputtered rhodium films for reflective coatings. Surf Coat Technol 202(13):2837–2843.  https://doi.org/10.1016/j.surfcoat.2007.10.014 CrossRefGoogle Scholar
  9. 9.
    Tabet-Aoul A, Mohamedi M (2013) Rhodium thin film-carbon nanotube nanostructure: synthesis, characterization and electron transfer properties. Thin Solid Films 534:270–274.  https://doi.org/10.1016/j.tsf.2013.03.002 CrossRefGoogle Scholar
  10. 10.
    Arbib M, Zhang B, Lazarov V, Stoychev D, Milchev A, Buess-Hermana C (2001) Electrochemical nucleation and growth of rhodium on gold substrates. J Electroanal Chem 510(1):67–77.  https://doi.org/10.1016/S0022-0728(01)00545-9 CrossRefGoogle Scholar
  11. 11.
    Miller AT, Hassler BL, Botte GG (2012) Rhodium electrodeposition on nickel electrodes used for urea electrolysis. J Appl Electrochem 42(11):925–934.  https://doi.org/10.1007/s10800-012-0478-1 CrossRefGoogle Scholar
  12. 12.
    Wu WP, Eliaz N, Gileadi E (2016) Electrodeposition of Re-Ni alloys from aqueous solutions with organic additives. Thin Solid Films 616:828–837.  https://doi.org/10.1016/j.tsf.2016.10.012 CrossRefGoogle Scholar
  13. 13.
    Wu WP (2016) Electrodeposition and thermal stability of Re60Ni40 amorphous alloy. Electrochem 84:699–704.  https://doi.org/10.5796/electrochemistry.84.699 CrossRefGoogle Scholar
  14. 14.
    Wu WP (2016) Effect of gelatin additive on microstructure and composition of electrodeposited rhenium–nickel alloys in aqueous solutions. Appl Phys A 122(12):1028–1035.  https://doi.org/10.1007/s00339-016-0567-9 CrossRefGoogle Scholar
  15. 15.
    Wu WP, Jiang JJ, Jiang P, Wang ZZ, Yuan NY, Ding JN (2018) Electrodeposition of nickel-iridium alloy films from aqueous solutions. Appl Surf Sci 434:307–317.  https://doi.org/10.1016/j.apsusc.2017.10.180 CrossRefGoogle Scholar
  16. 16.
    Wu WP, Wang ZZ, Jiang P, Tang ZP (2017) Effect of electroplating variables on electrodeposition of Ni rich Ni-Ir alloys from citrate aqueous solutions. J Electrochem Soc 164(14):D985–D993.  https://doi.org/10.1016/j.apsusc.2017.10.180 CrossRefGoogle Scholar
  17. 17.
    Eliaz N, Gileadi E (2018) Physical electrochemistry—fundamentals, techniques, and applications, 2nd edn. Wiley-VCH, Weinheim, p 327Google Scholar
  18. 18.
    Pletcher D, Urbina RI (1997) Electrodeposition of rhodium. Part 2. Sulfate solutions. J Electroanal Chem 421(1–2):145–151.  https://doi.org/10.1016/S0022-0728(96)04845-0 CrossRefGoogle Scholar
  19. 19.
    Armstrong MJ, Omweg GM, Ramasubramanian M (2008) Rhodium sulfate production for rhodium plating. US Patent, No. 20080063594A1Google Scholar
  20. 20.
    Pletcher D, Urbina RI (1997) Electrodeposition of rhodium. Part 1. Chloride solutions. J Electroanal Chem 421(1–2):137–144.  https://doi.org/10.1016/S0022-0728(96)04844-9 CrossRefGoogle Scholar
  21. 21.
    Varentsov VK, Varentsova VI (2003) Electrodeposition of rhodium on cathodes of carbon-fiber material from Rh (III) complexes in nitric acid solutions. Russ J Electrochem 39(6):703–705.  https://doi.org/10.1023/A:1024177900312 CrossRefGoogle Scholar
  22. 22.
    Yamazaki H (1990) Process for preparing rhodium nitrate solution: EP Patent, No. 0349698A1Google Scholar
  23. 23.
    Browning M, Solidum H (1973) Rhodium plating composition and method for plating rhodium. US Patent, No. 3729396AGoogle Scholar
  24. 24.
    Reid FH (1955) Some experimental and practical aspects of heavy rhodium plating. Trans IMF 33(1):105–140.  https://doi.org/10.1080/00202967.1955.11869693 CrossRefGoogle Scholar
  25. 25.
    Oliveira RTS, Santos MC, Bulhões LOS, Pereira EC (2004) Rh electrodeposition on Pt in acidic medium: a study using cyclic voltammetry and an electrochemical quartz crystal microbalance. J Electroanal Chem 569(2):233–240.  https://doi.org/10.1016/j.jelechem.2004.03.006 CrossRefGoogle Scholar
  26. 26.
    Kibler LA, Kleinert M, Kolb DM (1999) The initial stages of rhodium deposition on Au(111). J Electroanal Chem 467:249–257.  https://doi.org/10.1016/S0022-0728(99)00126-6 CrossRefGoogle Scholar
  27. 27.
    Mech K, Żabiński P, Kowalik R (2014) Analysis of rhodium electrodeposition from chloride solutions. J Electrochem Soc 161(9):D458–D461.  https://doi.org/10.1149/2.1101409jes CrossRefGoogle Scholar
  28. 28.
    Baraka AM, Shaarawy HH, Hamed HA (2002) Electrodeposition of rhodium metal on titanium substrates. Anti Corr Methods Mater 49(4):277–282.  https://doi.org/10.1108/00035590210431791 CrossRefGoogle Scholar
  29. 29.
    Sadeghi M, van den Winkel P, Afarideh H, Haji-Saeid M (2004) Thick rhodium electrodeposition on copper backing as the target for production of palladium-103. J Radioanal Nucl Chem 262(3):665–672.  https://doi.org/10.1007/s10967-004-0490-y CrossRefGoogle Scholar
  30. 30.
    Rudolf R, Budic B, Stamenkovic D, Čolic M, Ivanic A, Kosec B (2013) Rhodium platings—experimental study. Metalurgija 52(3): 337–340. UDC—UDK 669.14.018.298:669.18 = 111Google Scholar
  31. 31.
    Vukovic M (1988) Electrochemical investigation of an electrodeposited rhodium electrode in acid solutions. J Electroanal Chem 242:97–105.  https://doi.org/10.1016/0022-0728(88)80242-0 CrossRefGoogle Scholar
  32. 32.
    Panda H (2008) Handbook on electroplating with manufacture of electrochemicals. Asia Pacific Business Press Inc, Delhi, pp 201–208Google Scholar
  33. 33.
    Eliaz N, Gileadi E (2008) Induced codeposition of alloys of tungsten, molybdenum and rhenium with transition metals. In: Vayenas CG, White RE, Gamboa-Aldeco ME (eds) Mod Aspects Electrochem. Springer, New York, pp 191–301CrossRefGoogle Scholar
  34. 34.
    Jones T (2005) Electrodeposition of the precious metals: osmium, iridium, rhodium, rhenium, ruthenium, Revised edn. Finishing Publications Limited, Stevenage, pp 20–68Google Scholar
  35. 35.
    Natter H, Hempelmann R (1996) Nanocrystalline copper by pulsed electrodeposition: the effects of organic additives, bath temperature, and pH. J Phys Chem 100(50):19525–19532.  https://doi.org/10.1021/jp9617837 CrossRefGoogle Scholar
  36. 36.
    Wu WP, Eliaz N, Gileadi E (2015) The effects of pH and temperature on electrodeposition of Re-Ir-Ni alloy from aqueous solutions. J Electrochem Soc 162:D20–D26.  https://doi.org/10.1149/2.0281501jes CrossRefGoogle Scholar
  37. 37.
    Budevski E, Staikov G, Lorenz WJ (1996) Electrochemical phase formation and growth. VCH, Weinheim, p 163CrossRefGoogle Scholar
  38. 38.
    Peuckert M (1984) A comparison of thermally and electrochemically prepared oxidation adlayers on rhodium: chemical nature and thermal stability. Surf Sci 141:500–514.  https://doi.org/10.1016/0039-6028(84)90145-6 CrossRefGoogle Scholar
  39. 39.
    Jerkiewicz G, Borodzinski JJ (1994) Relation between the surface states of oxide films at Rh electrodes and kinetics of the oxygen evolution reaction. J Chem Soc Faraday Trans 90:3669–3675.  https://doi.org/10.1039/FT9949003669 CrossRefGoogle Scholar
  40. 40.
    Joseph Anthony A, Conor Anthony D, Peter E, Joseph John M Jr (2001) Rhodium sulfate compounds and rhodium plating. US Patent No. 6241870Google Scholar
  41. 41.
    Schulz EN, Salinas DR, García SG (2010) Electrodeposition of rhodium onto a pre-treated glassy carbon surface. Electrochem Commun 12(4):583–586.  https://doi.org/10.1016/j.elecom.2010.02.005 CrossRefGoogle Scholar
  42. 42.
    Yu B-C, Kim S-K, Sohn J-S, Kim B-S, Rhee K-I, Sohn H-J (2014) Electrochemical behaviour and electrowinning of rhodium in acidic chloride solution. J Appl Electrochem 44(6):741–745.  https://doi.org/10.1007/s10800-014-0683-1 CrossRefGoogle Scholar

Copyright information

© Springer Nature B.V. 2019

Authors and Affiliations

  1. 1.Electrochemistry and Corrosion Laboratory, School of Mechanical EngineeringChangzhou UniversityChangzhouPeople’s Republic of China
  2. 2.Department of Biochemical Engineering, School of Pharmaceutical Engineering & Life ScienceChangzhou UniversityChangzhouPeople’s Republic of China

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