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Cellulose

, Volume 26, Issue 16, pp 8867–8875 | Cite as

Mulberry-paper-based composites for flexible electronics and energy storage devices

  • Youngjae Seo
  • Byungil HwangEmail author
Original Research

Abstract

Mulberry paper comprising holocellulose shows excellent mechanical and chemical stability suitable for paper-based electronics. However, most studies pertaining to paper-based electronics have used conventional paper. Therefore, in this study, we demonstrated Ag nanoparticle (AgNP)/Ag nanowire (AgNW) flexible composites on mulberry-paper substrates. The AgNP/AgNW composites were fabricated by the dry transfer method, where the AgNP/AgNW layers were transferred from a polymer substrate with a hydrophobic surface to the toner-printed mulberry paper via hot pressing. Microstructural analysis showed that the mulberry papers contained thicker fibres than those in conventional papers, which limited the uniform transfer of the AgNP/AgNW layers on the mulberry papers. Therefore, we optimised the hot pressing conditions to 30 MPa and 80 °C, which allowed for the successful formation of the AgNP/AgNW composites on mulberry papers. Cyclic bending test results over 10,000 cycles revealed that the mulberry-paper-based composites showed better mechanical reliability with 30–40% smaller increases in resistance compared to those in conventional A4-paper-based composites. Lastly, a flexible supercapacitor fabricated using the mulberry-paper-based composite as the current collector showed excellent reliability without significant capacitance degradation over 100 bending cycles.

Graphic abstract

Keywords

Mulberry paper Holocellulose Composite Flexible Silver Nanowire 

Notes

Acknowledgments

This Research was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (No. 2018R1C1B5043900).

Supplementary material

10570_2019_2686_MOESM1_ESM.pdf (379 kb)
Supplementary material 1 (PDF 379 kb)

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Copyright information

© Springer Nature B.V. 2019

Authors and Affiliations

  1. 1.School of Integrative EngineeringChung-Ang UniversitySeoulRepublic of Korea

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