Design and band coalition of dual band microstrip filter using DGS, coupled line structures and series inductive metallic vias
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An approach to design compact dual band BPF and technique to unite the two bands into a single wide band is presented in this paper. The novelty of the filter stands on the application of series of metallic vias which are used to merge the bands obtained using coupled line circuits and DGS structure. The coupled line filter and the coupled line filter integrated with DGS shows passband resonance at 4.5 GHz and 5.1 GHz within the microwave frequency of operation. Series metallic vias are used to merge the passbands into a single wider passband of bandwidth 1.6 GHz (3.5–5.1 GHz). The filter configurations are fed using stepped-impedance open stub technique to reduce cross coupling between adjacent structures. Moreover effects of several salient filter parameters like gap between edge of the microstrip coupled line resonator and via series GV and gap between mid-point of the open ended feed line and via row GM are studied to achieve greater isolation at higher frequencies. All simulated designs are fabricated and experimentally studied to vindicate the practical performance of all filter configurations.
KeywordsStepped impedance open stub (SIOS) Defected ground structure (DGS) Microstrip coupled line Inductive posts Band pass filter (BPF)
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