Investigation on Bond-Slip Behavior of Z-Pin Interfaces in X-Cor® Sandwich Structures Using Z-Pin Pull-Out Test
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The Z-Pin interfacial bond properties play an important role in the structural performance of X-Cor® sandwich structures. This paper presents an experimental investigation on bond-slip behavior of Z-Pin interfaces using Z-Pin pull-out test. Based on the experimental data the whole Z-Pin pull-out process consists of three stages: initial bonding, debonding and frictional sliding. Comparative experimental study on the influence of design parameters on bond-slip behavior of Z-Pin interfaces has also been performed. Numerical analyses were conducted with the ABAQUS finite element (FE) program to simulate the Z-Pins bond-slip response of the pull-out test. The Z-Pins interfacial bond-slip behavior was implemented using nonlinear spring elements characterized with the constitutive relation from experimental results. Numerical results were validated by comparison with experimental data, and reasonably good agreement was achieved between experimental and analytical pull-out force-slip curves.
KeywordsX-Cor® sandwich structures Z-Pin interfaces Bond-slip behavior Pull-out test FE simulation
The experimental data in this paper about Z-Pin pulled out from face sheets with a thickness of 3 mm are derived from reference . -Experimental Study on Z-Pin Bridging Law by Pullout Test. Thanks again!
This study was supported by the Fundamental Research Funds for the Central Universities (NUAA NS2015099).
Compliance with Ethical Standards
The author declared no potential conflicts of interest with respect to the research, authorship, and/or publication of this article.
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