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Design, modelling and system level simulations of DRIE-based MEMS differential capacitive accelerometer

  • R. MukhiyaEmail author
  • P. Agarwal
  • S. Badjatya
  • M. Garg
  • P. Gaikwad
  • S. Sinha
  • A. K. Singh
  • R. Gopal
Technical Paper
  • 38 Downloads

Abstract

The paper presents design, analytical modelling and system level simulations of a highly sensitive single-axis in-plane Micro-Electro-Mechanical-Systems (MEMS) differential capacitive accelerometer. The designed accelerometer is Deep-Reactive-Ion-Etching (DRIE)-based with Silicon-on-Insulator (SOI) wafer technology. Analytical models have been derived for frequency as well as transient response analysis. For system level simulations, accelerometer model were extracted from MEMS+® and further integration for the readout electronics were performed using MATLAB Simulink® module. The accelerometer has response time of 0.7 ms and settling time of 5 ms. The accelerometer has the displacement sensitivity of 0.121 μm/g, capacitive sensitivity of 225 fF/g and electrical sensitivity of 0.34 V/g for MS3110 capacitive to voltage readout circuitry, with a resolution of better than 1 mg. The device shows very less non-linearity (~ 0.3%) in the operating range of ± 5 g with a bandwidth of 100 Hz. The simulation results of designed open-loop readout circuitry to read the applied acceleration in terms of voltage are also presented.

Notes

Acknowledgements

The authors would like to acknowledge the Director, CSIR-CEERI, Pilani for his generous support. We are thankful to all the members and technical staff of Process Technology Group (Smart Sensors Area) for their help and motivation. Financial support from CSIR, India is gratefully acknowledged.

References

  1. Abarca-Jiménez GS, Reyes-Barranca MA, Mendoza-Acevedo S, Munguia-Cervantes JE, Alemán-Arce MA (2014) Modal analysis of a structure used as a capacitive MEMS accelerometer sensor. In: 11th international conference on electrical engineering, computing science and automatic control (CCE) IEEE, pp 1–4Google Scholar
  2. Bais B, Majlis BY (2008) Low-g area-changed MEMS accelerometer using bulk silicon technique. Am J Appl Sci 5(6):626–632CrossRefGoogle Scholar
  3. Bao M, Yang H (2007) Squeeze film air damping in MEMS. Sens Actuators A 136(1):3–27MathSciNetCrossRefGoogle Scholar
  4. Chen JY (2010) Single-and dual-axis lateral capacitive accelerometers based on CMOS-MEMS technology. Master’s thesis, University of OsloGoogle Scholar
  5. Datasheet MUCRI (2004) MS3110 Universal Capacitive ReadoutTMIC. MicroSensors, Inc., 3001 Redhill Avenue, Costa Mesa, CA 92626Google Scholar
  6. Edalatfar F, Yaghootkar B, Qureshi AQA, Azimi S, Bahreyni B (2016) Design, fabrication and characterization of a high performance MEMS accelerometer. In: SENSORS 2016, IEEE, 30 Oct–3 Nov 2016, Orlando, FL, USA, pp 1–3Google Scholar
  7. Finkbeiner S (2013) MEMS for automotive and consumer electronics. In: Proceedings of the ESSCIRC (ESSCIRC), IEEE, 16–20 Sept 2013, Bucharest, Romania, pp 9–14Google Scholar
  8. Freescale Semiconductor (2007) Accelerometer terminology guide. Sensors, PeterboroughGoogle Scholar
  9. Gönenli İE, Çelik-Butler Z, Butler DP (2010) MEMS accelerometers on polyimides for failure assessment in aerospace systems. In: Sensors, 2010, IEEE, 1–4 Nov 2010, Kona, HI, USA, pp 1211–1215Google Scholar
  10. Kannan A (2008) Design and modeling of a MEMS-based accelerometer with pull in analysis. Doctoral dissertation, University of British ColumbiaGoogle Scholar
  11. Machado da Rocha LA (2005) Dynamics and nonlinearities of the electro-mechanical coupling in inertial MEMS. Doctoral dissertation TU Delft, DelftGoogle Scholar
  12. Mistry KK, Swamy KBM, Sen S (2010) Design of an SOI-MEMS high resolution capacitive type single axis accelerometer. Microsyst Technol 16(12):2057–2066CrossRefGoogle Scholar
  13. Mukhiya R, Gopal R, Pant BD, Khanna VK, Bhattacharyya TK (2015) Design, modeling and fem-based simulations of a 1-dof MEMS bulk micromachined piezoresistive accelerometer. Microsyst Technol 21(10):2241–2258CrossRefGoogle Scholar
  14. Qu H (2006) Development of DRIE CMOS-MEMS process and integrated accelerometers. Doctoral dissertation, University of FloridaGoogle Scholar
  15. Senturia SD (2001) Microsystem design. Springer, New YorkGoogle Scholar
  16. Sharma K, Macwan I, Zhang L, Hmurcik LV, Xiong X (2007) Design optimization of MEMS comb accelerometer. ASEE. http://www.asee.org/documents/zones/zone1/2008/student/ASEE12008_0050_paper.pdf
  17. Sinha S, Shakya S, Mukhiya R, Gopal R, Pant BD (2014) Design and simulation of MEMS differential capacitive accelerometer. In: Proceeding of ISSS international conference on smart materials, structures and systems, July 8–11, 2014, Bangalore, IndiaGoogle Scholar
  18. Van Spengen WM (2003) MEMS reliability from a failure mechanisms perspective. Microelectron Reliab 43(7):1049–1060CrossRefGoogle Scholar
  19. Yazdi N, Ayazi F, Najafi K (1998) Micromachined inertial sensors. Proc IEEE 86(8):1640–1659CrossRefGoogle Scholar
  20. Yazicioğlu RF (2003) Surface micromachined capacitive accelerometers using MEMS technology. Doctoral dissertation, Middle East Technical UniversityGoogle Scholar

Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  • R. Mukhiya
    • 1
    • 2
    Email author
  • P. Agarwal
    • 3
  • S. Badjatya
    • 3
  • M. Garg
    • 4
  • P. Gaikwad
    • 1
  • S. Sinha
    • 1
    • 2
  • A. K. Singh
    • 4
  • R. Gopal
    • 1
  1. 1.Smart Sensors AreaCSIR-Central Electronics Engineering Research Institute (CEERI)PilaniIndia
  2. 2.Academy of Scientific and Innovative Research (AcSIR)ChennaiIndia
  3. 3.Department of Mechanical EngineeringBITS-Pilani, K.K. Birla Goa CampusGoaIndia
  4. 4.Department of Electronics and Communication EngineeringPunjab Engineering College (Deemed to be University)ChandigarhIndia

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