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A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface

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Abstract

The use of tantalum as adhesion layer for Au/Si eutectic bonding was investigated and compared to the frequently used materials chromium or titanium in the case of oxidized silicon substrates. Suitable test structures have been fabricated, bonded and evaluated. The eutectically bonded chips were characterized in respect to the maximum bearable tensile and shear loading. Interfacial reactions were observed by SEM and optical microscopy. As a significant result when tantalum was used, the external load until fracture occurred could be increased up to a factor of 3 in comparison to usually applied chromium or titanium. Analyses after bonding gave no prove for diffusion between the metallic alloy and the adhesion layer and delamination could be minimized therefore.

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Acknowledgments

The author wants to thank the German Academic Exchange Service (DAAD) and the World Premier International Research Center Initiative at Tohoku University in Sendai/Japan for funding the research project and the kind support.

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Authors and Affiliations

  1. Fraunhofer ENAS, Technologie-Campus 3, 09126, Chemnitz, Germany

    M. Haubold, J. Frömel, M. Wiemer & T. Geßner

  2. Chemnitz University of Technology, Reichenhainer Straße 70, 09126, Chemnitz, Germany

    T. Geßner

  3. Micro/Nanomachining Research and Education Center, Graduate School of Engineering, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku, Sendai, 980-8579, Japan

    Y.-C. Lin & M. Esashi

Authors
  1. M. Haubold
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  2. Y.-C. Lin
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  3. J. Frömel
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  4. M. Wiemer
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  5. M. Esashi
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  6. T. Geßner
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Correspondence to M. Haubold.

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Haubold, M., Lin, YC., Frömel, J. et al. A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface. Microsyst Technol 18, 515–521 (2012). https://doi.org/10.1007/s00542-012-1440-1

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  • DOI: https://doi.org/10.1007/s00542-012-1440-1

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