Effect of hydrothermal aging on the dynamic mechanical performance of the room temperature-cured epoxy adhesive
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To evaluate the performance and reliability of a new type of epoxy resin adhesive, the dynamic mechanical analysis (DMA) testing was performed at different levels of temperature and frequency after hydrothermal aging. The results of the DMA and the thermodynamic analysis that the performance of the adhesive has little change after hydrothermal aging for 30 days meant that the resistance to hydrothermal aging of this adhesive was excellent. In addition, the time-temperature equivalence principle and time-aging time equivalence principle were proposed here to offer additional insights into the dynamic mechanical performance of the newly developed adhesive. Moreover, an effective method by which the generalized curve of definite aging time in certain conditions of definite temperature and humidity can be obtained was introduced.
KeywordsEpoxy resin adhesive Room temperature cured Hydrothermal aging Dynamic mechanical analysis
This work was supported by the Project of Hunan Provincial Science & Technology Department of PR China (No. 2010GK3110), the Key Project of the Education Department of Hunan Province of PR China (No. 10A130), and the Innovation Project of Postgraduate of Central South University of Forestry & Technology of PR China (No. 20181008).
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