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Polymer Bulletin

, Volume 75, Issue 9, pp 4207–4225 | Cite as

Microwave-shielding behavior of silanized Cu and Cu–Fe3O4 compound particle-reinforced epoxy resin composite in E-, F-, I-, and J-band frequencies

  • V. R. Arun Prakash
  • R. Viswanathan
Original Paper
  • 78 Downloads

Abstract

In this work, microwave-shielding behavior of epoxy thermosetting plastic reinforced with silanized Cu and Cu–Fe3O4 compound particles were studied in frequency bands E, F, I, and J. The principal aim of this work is to evaluate the significant advantage of surface-modified magnetic and conductive fillers over as-received fillers in microwave shielding. The conductive and magnetic properties of epoxy resin were improved by additions of Cu and Fe3O4 particles. Compound particles of Cu–Fe3O4 were produced by mechanical alloying process (ball milling). The compound particles were surface treated by 3-Aminopropyltrimethoxysilane (APTMS) for better dispersion in epoxy resin matrix. Functional groups on particle’s surface after silane surface treatment were confirmed by FT-IR spectra analysis. The TEM images revealed that effective Cu–Fe3O4 particle compounding was formed at 1 h milling time. The maximum dielectric constant of 6.8 and magnetization of 675E−6 were observed for surface-modified compound particle-reinforced epoxy composite designation RCF2. Similarly, maximum microwave attenuation of 35% (44 dB) was observed for surface-modified compound particle-reinforced composite designation RCF2 in ‘J’-band frequency.

Keywords

Polymer matrix composite Surface modification TEM Microwave shielding Epoxy resin Magnetite Iron oxide Fillers 

Notes

Funding

No funds information available.

Compliance with ethical standards

Conflict of interest

We have no conflict of interest.

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Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  1. 1.Department of Production TechnologyMIT, Anna UniversityChennaiIndia
  2. 2.Department of ChemistryJNN Institute of EngineeringChennaiIndia

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