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Cure behavior of epoxy resin/CdS/2,4-EMI nanocomposites investigated by dynamic torsional vibration method (DTVM)

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Summary

Epoxy resin/CdS nanocomposite was prepared by a novel method and its cure behavior was investigated by the HLX-II Resin Curemeter based on the dynamic torsional vibration method (DTVM). The non-equilibrium thermodynamic fluctuation theory, the Avrami equation and the Flory’s gelation theory have been used to analysis the cure behavior of the composite systems with different CdS and cure agent loadings at various temperatures. The results show that the addition of CdS nanoparticles reduces the gel time t g , but has little effect on the mechanism of the cure reaction. The theoretical prediction is in good agreement with the experimental results. The Avrami exponent of n decreases a little when the temperature increases.

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Authors and Affiliations

  1. Department of Polymer Science and Engineering, University of Science and Technology of China, Hefei, 230026, Anhui, China

    Yao Yuan, Chen Dazhu, He Pingsheng & Yang Haiyang

Authors
  1. Yao Yuan
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  2. Chen Dazhu
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  3. He Pingsheng
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  4. Yang Haiyang
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Correspondence to He Pingsheng.

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Yuan, Y., Dazhu, C., Pingsheng, H. et al. Cure behavior of epoxy resin/CdS/2,4-EMI nanocomposites investigated by dynamic torsional vibration method (DTVM). Polym. Bull. 57, 219–230 (2006). https://doi.org/10.1007/s00289-006-0550-2

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  • DOI: https://doi.org/10.1007/s00289-006-0550-2

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