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Heat and Mass Transfer

, Volume 55, Issue 2, pp 309–325 | Cite as

Heat transfer enhancement of round pin heat sinks using N-eicosane as PCM: an experimental study

  • Shah Rukh
  • Riffat Asim Pasha
  • Muhammad Ali NasirEmail author
Original
  • 104 Downloads

Abstract

This experimental work investigates the combination of phase change material (PCM) with thermal storage units to combat excessive heat generation in high application hand-held conveniences. Four heat sink configurations including a no fin and three pin-fin arrays having pin diameters of 2 mm, 3 mm and 4 mm respectively are tested using four discreet volume fractions (0.0, 0.3, 0.6, 0.9) of n-eicosane as PCM under heavy usage power levels of 5–7 W. Round pins, made in aluminum, are incorporated in 9% volume percentage of sink’s bulk to act as thermal conductivity enhancer (TCE) in heat sinks. Parametric probe involved the impact of n-eicosane volume fractions, spatial variation of temperature, Fourier number (Fo), enhancement ratio, Modified Stephan number (Ste*), heat capacity as well as thermal conductance to provide for insights on superior thermal performance for distinct operating conditions of the hand-held. The outturns proclaimed that increasing volume fractions of PCM result in increased service time of the heat sinks. Effect of pin-fin configurations were found to be negligible on spatial temperature variation. Amongst all heat sinks, 3 mm pin-fin arrangement resulted in highest enhancement ratio, heat capacity & thermal conductance for all volume fractions of n-eicosane, thereby, demonstrated best thermal conduct of all four sink arrays.

Keywords

Phase change material (PCM) Pin array Thermal conductivity enhancer (TCE) n-Eicosane Heat sinks 

Nomenclature

Ψ

PCM volume fraction

Open image in new windowPCM

PCM volume, m3

Vs

heat sink volume, m3

Vf

total pin volume, m3

Fo

Fourier Number, Fo = ∝PCMtset/L2

PCM

Thermal diffusivity (PCM), m2/s

L

sink length, m

tset

time required to reach SPT, min

Θ

Dimensionless temperature

Tset

asymptotic set point temperature, °C

Tbase

average heat sink base temperature, °C

T∞.

ambient temperature, °C

Ste*

Modified Stephan Number, Ste = QCP/KPCM λh

Q

heat input, W

CP

specific heat (PCM), J/kg K

KPCM

thermal capacity of PCM, W/m K

h

sink height, m

λ

Latent heat (PCM), KJ/Kg

Ф

TCE volume fraction

ξ

Enhancement Ratio

tCT(with TCE)

Time to reach STP of finned heat sink

tCT(without TCE)

Time to reach STP of un-finned heat sink

c

Heat capacity, KJ/K

Q

Heat transferred, KJ

△T

Change in temperature, K

G

Thermal conductivity, W/K

P

Power, W

Tmax

Maximum temperature after heating phase, K

Tamb

Room temperature, K

Subscripts

PCM

phase change material

TCE

thermal conductivity enhancer

CNC

computer numeric control

H

thermocouples on heat sink base

W

thermocouples in side walls

T

thermocouples immersed in PCM

TCE

thermal conductivity enhancer

PDA

personal digital assistant

LHTMS

latent heat thermal management system

TSU

thermal storage unit

TSE

thermal energy storage

NEPCM

Nano-enhance phase change material

TM

thermal management

MNCWT

multi-wall carbon nanotubes

GNT

graphene nanoplatelets

CNT

carbon nanoplates

CF

carbon foam

SPT

set point temperature

Notes

Compliance with ethical standards

Conflict of interest

The authors of the article have no conflict of interest.

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Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringUniversity of Engineering & TechnologyTaxilaPakistan

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