Non-isocyanate polyurethane adhesive from sucrose used for particleboard

  • Xuedong Xi
  • Zhigang Wu
  • Antonio PizziEmail author
  • Christine Gerardin
  • Hong LeiEmail author
  • Bengang Zhang
  • Guanben Du


Sucrose-based non-isocyanate polyurethanes (S-NIPU) were synthesized by the already codified reaction of sucrose, dimethyl carbonate and hexamethylene diamine and used for the first time as adhesives for bonding particleboard. To decrease the NIPU adhesive curing temperature, a silane coupling agent was used as a crosslinking promoter. The performance of particleboards prepared at a press temperature of 230 °C, 200 °C and 180 °C and a press time of 8 min, 10 min and 12 min was tested and evaluated. The structure of the oligomers obtained was detected by matrix-assisted laser desorption ionization time-of-flight mass spectrometry. Thermomechanical analysis and differential scanning calorimetry were also used to analyze their behavior. The particleboards bonded with the S-NIPU adhesive at 230 °C showed excellent properties, which, however, decreased as the press time was reduced. The silane coupling agent used as a crosslinking promoter significantly reduced the curing temperature of the adhesive and allowed to obtain good bonding at a lower press temperature. The results obtained confirmed that coupling the S-NIPU adhesive with a silane used as a crosslinking promoter can yield sufficiently improved results to function as a suitable adhesive for particleboard, medium density fiberboard and other types of particulate wood panels. It was also the first time that a NIPU adhesive was used for wood bonding.



This work was supported by National Natural Science Foundation of China (31660176, 31800481 and 31870546). The first author thanks the China Scholarship Council for the study bursary granted to him. The LERMAB of the University of Lorraine is supported by a grant overseen by the French National Research Agency (ANR) as part of the Laboratory of Excellence (Labex) ARBRE.

Supplementary material

226_2019_1083_MOESM1_ESM.doc (616 kb)
Supplementary material 1 (DOC 615 kb)


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Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  • Xuedong Xi
    • 1
    • 2
  • Zhigang Wu
    • 3
  • Antonio Pizzi
    • 1
    Email author
  • Christine Gerardin
    • 4
  • Hong Lei
    • 2
    Email author
  • Bengang Zhang
    • 2
  • Guanben Du
    • 2
  1. 1.LERMABUniversity of LorraineÉpinalFrance
  2. 2.Yunnan Key Laboratory of Wood Adhesives and Glue ProductsSouthwest Forestry UniversityKunmingChina
  3. 3.College of ForestryGuizhou UniversityGuiyangChina
  4. 4.LERMABUniversity of LorraineNancyFrance

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