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Ductility-oriented high-speed grinding of silicon carbide and process design for quality and damage control with higher efficiency

  • Chongjun Wu
  • Weicheng Guo
  • Zhouping Wu
  • Qingxia WangEmail author
  • Beizhi Li
ORIGINAL ARTICLE
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Abstract

Grinding of brittle materials is always a removal process of coexisting ductile and brittle removal modes. Ductility-oriented grinding has been regarded as a precision machining pursuit for grinding quality and efficiency. This paper is devoted to investigating ductility-oriented grinding mechanism and process design for quality promotion with a higher efficiency in high-speed grinding of silicon carbide ceramics. The Rayleigh chip thickness model and critical chip thickness model are given to quantitatively calculate the ductile removal proportion. Moreover, the grinding forces and specific removal energy are discussed to reflect the high-speed grinding removal mode. The results show that the increase of wheel speed or decrease of maximum chip thickness could enhance the percentage to a more ductile-oriented removal mode, which will cause a smaller surface roughness with fewer fracture cracks and more plastic removal stripes. Finally, the grinding process conditions for surface roughness below 0.2 μm and ductile removal area higher than 50% are suggested to obtain better surface quality at higher ductile removal and material removal rates.

Keywords

Ductile grinding Silicon carbide Process design Grinding damages Grinding quality 

Notes

Funding information

This work is supported in by the Fundamental Research Funds for the Shanghai Sailing Program (19YF1401400), the Shanghai Scientific Research Program (17DZ2281000), the Central Universities (2232018D3-14), and China Postdoctoral Science Foundation (2018M630384).

References

  1. 1.
    Agarwal S, Rao PV (2011) Improvement in productivity in SiC grinding. Proc Inst Mech Eng B-J Mech Eng Sci. 225(6):811–830CrossRefGoogle Scholar
  2. 2.
    Xiao GB, To S, Zhang GQ (2015) The mechanism for ductile deformation in ductile regime machining of 6H SiC. Comp Mater Sci. 98:178–188CrossRefGoogle Scholar
  3. 3.
    Zhu DH, Yan SJ, Li BZ (2014) Single-grit modeling and simulation of crack initiation and propagation in SiC grinding using maximum undeformed chip thickness. Comp Mater Sci. 92:13–21CrossRefGoogle Scholar
  4. 4.
    Frangulyan TS, Vasilev IP, Ghyngazov SA (2018) Effect of grinding and subsequent thermal annealing on phase composition of subsurface layers of zirconia ceramics. Ceram Int. 44(2):2501–2503CrossRefGoogle Scholar
  5. 5.
    Esmaeilzare A, Rahimi A, Rezaei SM (2014) Investigation of subsurface damages and surface roughness in grinding process of Zerodur® glass–ceramic. Appl Surf Sci. 313:67–75CrossRefGoogle Scholar
  6. 6.
    Yue CX, Gao HN, Liu XL, Liang SY, Wang LH (2019) A review of chatter vibration research in milling. Chinese J Aeronaut. 32(2):215–242CrossRefGoogle Scholar
  7. 7.
    Huang H, Liu YC (2003) Experimental investigations of machining characteristics and removal mechanisms of advanced ceramics in high speed deep grinding. Int J Mach Tool Manuf. 43(8):811–823CrossRefGoogle Scholar
  8. 8.
    Ding ZS, Sun GX, Jiang XH, Guo MX, Liang SY (2019) Predictive modeling of microgrinding force incorporating phase transformation effects. J Manuf Sci Eng Trans ASME. 141(8):081009CrossRefGoogle Scholar
  9. 9.
    Jiang XH, Kong XJ, Zhang ZY, Wu ZP, Ding ZS, Guo MX (2020) Modeling the effects of Undeformed Chip Volume (UCV) on residual stresses during the milling of curved thin-walled parts. Int J Mech Sci. 167:105162.  https://doi.org/10.1016/j.ijmecsci.2019.105162 CrossRefGoogle Scholar
  10. 10.
    Wu CJ, Pang JZ, Li BZ, Liang SY (2019) High-speed grinding of HIP-SiC ceramics on transformation of microscopic features. Int J Adv Manuf Technol. 102:1913–1921.  https://doi.org/10.1007/s00170-018-03226-4 CrossRefGoogle Scholar
  11. 11.
    Wang CC, Chen JB, Fang QH, Liu F, Liu YW (2016) Study on brittle material removal in the grinding process utilizing theoretical analysis and numerical simulation. Int J Adv Manuf Technol. 87:2603–2614CrossRefGoogle Scholar
  12. 12.
    Yang M, Li CH, Zhang YB, Jia DZ, Zhang XP, Hou YL, Li RZ, Wang J (2017) Maximum undeformed equivalent chip thickness for ductile-brittle transition of zirconia ceramics under different lubrication conditions. Int J Mach Tool Manuf. 122:55–65CrossRefGoogle Scholar
  13. 13.
    Bifano TG, Dow TA, Scattergood RO (1991) Ductile-regime grinding: a new technology for machining brittle materials. J Eng Ind Trans ASME. 113(2):184–189CrossRefGoogle Scholar
  14. 14.
    Wu CJ, Li BZ, Liang SY (2016) A critical energy model for brittle-ductile transition in grinding considering wheel speed and chip thickness effects. Proc Inst Mech Eng B-J Mech Eng Sci. 230(8):1372–1380CrossRefGoogle Scholar
  15. 15.
    Venkatachalam S, Li XP, Liang SY (2009) Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials. J Mater Process Technol. 209(7):3306–3319CrossRefGoogle Scholar
  16. 16.
    Wang CC, Fang QH, Chen JB, Liu YW, Jin T (2016) Subsurface damage in high-speed grinding of brittle materials considering kinematic characteristics of the grinding process. Int J Adv Manuf Technol. 83:937–948CrossRefGoogle Scholar
  17. 17.
    Li HN, Yu TB, Wang ZX, Zhu LD, Wang WS (2017) Detailed modeling of cutting forces in grinding process considering variable stages of grain-workpiece micro interactions. Int J Mech Sci. 126:319–339CrossRefGoogle Scholar
  18. 18.
    Hecker RL, Liang SY, Wu XJ, Jing D (2007) Grinding force and power modeling based on chip thickness analysis. Int J Adv Manuf Technol. 33:449–459CrossRefGoogle Scholar
  19. 19.
    Pang JZ, Wu CJ, Shen YM, Liu SQ, Wang QX, Li BZ (2019) Heat flux distribution and temperature prediction model for dry and wet cylindrical plunge grinding. Proc Inst Mech Eng B-J Mech Eng Sci. 233(10):2047–2060CrossRefGoogle Scholar
  20. 20.
    Wu CJ, Li BZ, Liu Y, Liang SY (2017) Surface roughness modeling for grinding of silicon carbide ceramics considering co-existing of brittleness and ductility. Int J Mech Sci. 133:167–177CrossRefGoogle Scholar
  21. 21.
    Wu CJ, Li BZ, Yang JG, Liang SY (2016) Prediction of grinding force for brittle materials considering co-existing of ductility and brittleness. Int J Adv Manuf Technol 87:1967–1975CrossRefGoogle Scholar
  22. 22.
    Malkin S, Hwang TW (1996) Grinding mechanisms for ceramics. CIRP Ann Manuf Technol. 456(2):569–580CrossRefGoogle Scholar
  23. 23.
    Agarwal S, Rao PV (2013) Predictive modeling of force and power based on a new analytical undeformed chip thickness model in ceramic grinding. Int J Mach Tool Manuf. 65(2):68–78CrossRefGoogle Scholar
  24. 24.
    Simanchal KPP, Bandyopadhyay SP (2017) High speed and precision grinding of plasma sprayed oxide ceramic coatings. Ceram Int. 43:15316–15331CrossRefGoogle Scholar
  25. 25.
    Chen MJ, Zhao QL, Dong S (2005) The critical conditions of brittle–ductile transition and the factors influencing the surface quality of brittle materials in ultra-precision grinding. J Mater Process Technol. 168(1):75–82CrossRefGoogle Scholar
  26. 26.
    Dai C.W., Yin Z., Ding W.F., Zhu Y.J. (2019) Grinding force and energy modeling of textured monolayer CBN wheels considering undeformed chip thickness nonuniformity. Int J Mech Sci. (157-158):221-230.CrossRefGoogle Scholar
  27. 27.
    Lin XH, Ke XL, Ye H, Hu CL, Guo YB (2017) Investigation of surface/subsurface integrity and grinding force in grinding of BK7 glass. Proc Inst Mech Eng B-J Mech Eng Sci. 231(12):2349–2356Google Scholar
  28. 28.
    Shao YM, Li BZ, Liang SY (2015) Predictive modeling of surface roughness in grinding of ceramics. Mach Sci Technol. 19(2):325–338CrossRefGoogle Scholar

Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2019

Authors and Affiliations

  • Chongjun Wu
    • 1
  • Weicheng Guo
    • 1
  • Zhouping Wu
    • 2
  • Qingxia Wang
    • 1
    Email author
  • Beizhi Li
    • 1
  1. 1.College of Mechanical EngineeringDonghua UniversityShanghaiChina
  2. 2.Shanghai Spaceflight Manufacture (Group) Co., Ltd.ShanghaiChina

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