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Wear behavior of metal bond diamond composite with hollow spherical silica particles as pore former

  • Yanping Wu
  • Qingzhi YanEmail author
  • Xiaoxin ZhangEmail author
ORIGINAL ARTICLE
  • 55 Downloads

Abstract

To obtain the high grinding efficiency and good self-dressing performance for the metal bond diamond grinding tools, hollow spherical silica particles with different contents were introduced into Fe-based diamond composites as pore former. A pin-on-disc wear test was performed to assess the wear properties and grinding performance of the fabricated specimens, and the morphological properties of the worn surface were evaluated. Results show that the porosity of the Fe-based diamond composite was positively correlated with the content of silica particles. These pores provided chip-storage spaces and an appropriate ratio between wear of the matrix and diamond grits in the grinding process. Therefore, as the porosity of the specimens increased, the wear of the Fe-based diamond composites increased. However, the maximum disc/pin wear ratio with a value of 47 was obtained at the specimen with 0.5 wt% silica particle addition, of which porosity is 3.5%. At this addition amount, the bending strength also reached the maximum value of 1127 MPa.

Keywords

Diamond composite Silica particle Wear behavior Self-dressing 

Notes

Funding information

This study was funded by the National Natural Science Foundation of China (grant no. 51572026).

Compliance with ethical standards

Conflict of interest

The authors declare that they have no conflict of interest.

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Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2019

Authors and Affiliations

  1. 1.Laboratory of Special Ceramics and Powder Metallurgy, School of Materials Science and EngineeringUniversity of Science and Technology BeijingBeijingChina
  2. 2.Advanced Energy Research CenterShenzhen UniversityShenzhenChina
  3. 3.Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Optoelectronic EngineeringShenzhen UniversityShenzhenChina

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