Fabrication of Al7075/PI composites base on FSW technology

  • Jicheng GaoEmail author
  • Sunyi Zhang
  • Huiming Jin
  • Yifu Shen


In this paper, polyimide (PI) particles-reinforced Al7075 composite is fabricated via friction stir processing (FSP) since it has potential applications in the field of aeronautics and astronautics, automobile, and shipbuilding. The microstructure evaluation shows that the uniform distribution of PI particle is not obtained after one pass. The dispersibility of the PI particles is improved with the increase of the passes. No evidence of impurity phases is introduced by analyzing the X-ray diffraction (XRD) results. Microhardness test results indicate that the microhardness is higher than the base metal but lower than the FSP sample. The wear test results show that the minimum wear volume of composites is 0.521 mm3, which is 68% of the matrix.


Friction stir processing Al7075/PI composites Microstructure Wear volume 



friction stir processing


friction stir welding


The Welding Institute




scanning electron microscopes


optical microscope


energy-dispersive x-ray spectroscope


x-ray diffraction


advancing side


retreating side


base metal


heat-affected zone


thermo-mechanically affected zone


stir zone


Funding information

The author(s) disclosed receipt of the following financial support for the research, authorship, and/or publication of this article: The Natural Science Foundation of the Jiangsu Higher Education Institutions of China (18KJB460031), Project funded by China Postdoctoral Science Foundation (2018 M642337).


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Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2019

Authors and Affiliations

  • Jicheng Gao
    • 1
    Email author
  • Sunyi Zhang
    • 1
  • Huiming Jin
    • 1
  • Yifu Shen
    • 2
  1. 1.College of Mechanical EngineeringYangzhou UniversityYangzhouPeople’s Republic of China
  2. 2.College of Materials Science and TechnologyNanjing University of Aeronautics and AstronauticsNanjingPeople’s Republic of China

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