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A comparative study on hot deformation and solid-state bonding behavior of aluminum alloys for the integration of solid-state joining and forming processes

  • Junquan Yu
  • Guoqun ZhaoEmail author
  • Xiaoxue Chen
  • Mengchao Liang
ORIGINAL ARTICLE
  • 122 Downloads

Abstract

For improving production efficiency and saving energy, various manufacturing technologies for integrating solid-state joining and plastic forming processes have become hot topics in recent years. Hot deformation and solid-state bonding of materials are essences for the integration of solid-state joining and plastic forming processes. This study compared the hot deformation and solid-state bonding behavior of an Al-Mg-Si alloy at the temperatures ranging from 673 to 803 K and the strain rates ranging from 0.001 to 10 s−1 using conventional hot isothermal compression tests (CHICT) and hot isothermal compression bonding tests (HICBT). The flow stress behavior of the material during CHICT and HICBT was compared, and a constitutive equation was established based on the true stress-strain curves obtained from HICBT. The evolution of grain structure and bonding interface in the processes of hot deformation and solid-state bonding was investigated. Furthermore, the quantitative relationship between the interfacial bonding degree and the temperature and strain rate was established, and the relationship between the bonding degree and the mechanical properties of the welds was discussed. A new parameter, RSS, was proposed to evaluate the solid-state weldability of materials.

Keywords

Al-Mg-Si alloy Hot compression Solid-state bonding Microstructural evolution Interface bonding fraction Shearing strength 

Notes

Funding information

This project is financially supported by the National Natural Science Foundation of China (Grant No. 51735008) and Scientific and Technological Innovation Project of Shandong Province of China (Grant No. 2017CXGC0401).

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Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2019

Authors and Affiliations

  • Junquan Yu
    • 1
  • Guoqun Zhao
    • 1
    Email author
  • Xiaoxue Chen
    • 1
  • Mengchao Liang
    • 1
  1. 1.Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education)Shandong UniversityJinanPR China

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