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An investigation in the ultra-precision fly cutting of freeform surfaces on brittle materials with high machining efficiency and low tool wear

  • Zhanwen Sun
  • Suet ToEmail author
  • K. M. Yu
ORIGINAL ARTICLE
  • 71 Downloads

Abstract

In diamond machining of freeform surface on brittle materials, very small machining parameters are necessarily adopted to suppress the brittle fractures, which inevitably leads to low processing efficiency as well as fast tool wear. In the present study, ultra-precision fly cutting is first adopted in processing brittle materials for freeform surfaces to improve machining efficiency and reduce tool wear. In fly cutting, a large swing radius (over 40 mm) is configured between the diamond tool tip and the rotation axis of the spindle, so the workpiece material is intermittently removed by the periodical cut-in and cut-out movement of the diamond tool. The theoretical results show that this unique process generates a very small chip thickness (80 nm) even under large feed rates (9 μm/r) and cutting depths (70 μm), which accordingly improves the machining efficiency without generating brittle fractures. The experimental results show that only 200 min is needed in fly cutting of an F-theta lens with height variation over 50 μm on single-crystal silicon, while over doubled time is needed for conventional slow tool servo. The generated surface is very smooth and uniform with a roughness of only 6 nm Sa. Besides, only micro-ruggedness of diamond tool is formed in fly cutting without the premature appearance of the micro-chips, which enhances tool life and reduces the re-sharpening cost of diamond tools in processing brittle materials.

Keywords

Brittle materials Freeform surfaces Tool wear patterns Ultra-precision fly cutting 

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Notes

Funding information

This work was supported partially by the Research Committee of The Hong Kong Polytechnic University (Project Code: RUNS).

References

  1. 1.
    Hong Z, Liang R (2017) IR-laser assisted additive freeform optics manufacturing. Sci Rep 7:7145CrossRefGoogle Scholar
  2. 2.
    Zhu L, Li Z, Fang F, Huang S, Zhang X (2018) Review on fast tool servo machining of optical freeform surfaces. Int J Adv Manuf Technol 95:2071–2092CrossRefGoogle Scholar
  3. 3.
    Liu H, Xie W, Sun Y, Zhu X, Wang M (2018) Investigations on brittle-ductile cutting transition and crack formation in diamond cutting of mono-crystalline silicon. Int J Adv Manuf Technol 95:317–326CrossRefGoogle Scholar
  4. 4.
    Xiao G, To S, Jelenković E (2015) Effects of non-amorphizing hydrogen ion implantation on anisotropy in micro cutting of silicon. J Mater Process Technol 225:439–450CrossRefGoogle Scholar
  5. 5.
    Pachaury Y, Tandon P (2017) An overview of electric discharge machining of ceramics and ceramic based composites. J Manuf Process 25:369–390CrossRefGoogle Scholar
  6. 6.
    Azarhoushang B, Soltani B, Zahedi A (2017) Laser-assisted grinding of silicon nitride by picosecond laser. Int J Adv Manuf Technol 93:2517–2529CrossRefGoogle Scholar
  7. 7.
    Liu X-Q, Yu L, Ma Z-C, Chen Q-D (2017) Silicon three-dimensional structures fabricated by femtosecond laser modification with dry etching. Appl Opt 56:2157–2161CrossRefGoogle Scholar
  8. 8.
    Hourmand M, Sarhan AA, Sayuti M (2017) Micro-electrode fabrication processes for micro-EDM drilling and milling: a state-of-the-art review. Int J Adv Manuf Technol 91:1023–1056CrossRefGoogle Scholar
  9. 9.
    Mukaida M, Yan J (2017) Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo. Int J Mach Tools Manuf 115:2–14CrossRefGoogle Scholar
  10. 10.
    Zhang S, Yu J, To S, Xiong Z (2018) A theoretical and experimental study of spindle imbalance induced forced vibration and its effect on surface generation in diamond turning. Int J Mach Tools Manuf 133:61–71CrossRefGoogle Scholar
  11. 11.
    Sun Z, To S, Zhang S, Zhang G (2018) Theoretical and experimental investigation into non-uniformity of surface generation in micro-milling. Int J Mech Sci 140:313–324CrossRefGoogle Scholar
  12. 12.
    Dutterer BS, Lineberger JL, Smilie PJ, Hildebrand DS, Harriman TA, Davies MA, Suleski TJ, Lucca DA (2014) Diamond milling of an Alvarez lens in germanium. Precis Eng 38:398–408CrossRefGoogle Scholar
  13. 13.
    Bai J, Bai Q, Hu C, He X, Pei X (2018) Research on the ductile-mode machining of monocrystalline silicon using polycrystalline diamond (PCD) tools. Int J Adv Manuf Technol 94:1981–1989CrossRefGoogle Scholar
  14. 14.
    Bian R, He N, Ding W, Liu S (2017) A study on the tool wear of PCD micro end mills in ductile milling of ZrO2 ceramics. Int J Adv Manuf Technol 92:2197–2206CrossRefGoogle Scholar
  15. 15.
    Przestacki D, Chwalczuk T, Wojciechowski S (2017) The study on minimum uncut chip thickness and cutting forces during laser-assisted turning of WC/NiCr clad layers. Int J Adv Manuf Technol 91:3887–3898CrossRefGoogle Scholar
  16. 16.
    X.-F. Song, J.-J. Yang, H.-T. Ren, B. Lin, Y. Nakanishi, L. Yin (2018) Ultrasonic assisted high rotational speed diamond machining of dental glass ceramics, Int J Adv Manuf Technol 1–13Google Scholar
  17. 17.
    Huo D (2013) Micro-cutting: fundamentals and applications. John Wiley & SonsGoogle Scholar
  18. 18.
    Krolczyk G, Maruda R, Krolczyk J, Nieslony P, Wojciechowski S, Legutko S (2018) Parametric and nonparametric description of the surface topography in the dry and MQCL cutting conditions. Measurement 121:225–239CrossRefGoogle Scholar
  19. 19.
    Grabon W, Pawlus P (2018) Improvement of the Rpq parameter calculation. Measurement 129:236–244CrossRefGoogle Scholar
  20. 20.
    Krolczyk G, Maruda R, Nieslony P, Wieczorowski M (2016) Surface morphology analysis of duplex stainless steel (DSS) in clean production using the power spectral density. Measurement 94:464–470CrossRefGoogle Scholar
  21. 21.
    Keen D (1971) Some observations on the wear of diamond tools used in piston machining. Wear 17:195–208CrossRefGoogle Scholar
  22. 22.
    Durazo-Cardenas I, Shore P, Luo X, Jacklin T, Impey S, Cox A (2007) 3D characterisation of tool wear whilst diamond turning silicon. Wear 262:340–349CrossRefGoogle Scholar
  23. 23.
    Sun Z, To S, Yu K (2018) One-step generation of hybrid micro-optics with high-frequency diffractive structures on infrared materials by ultra-precision side milling. Opt Express 26:28161–28177CrossRefGoogle Scholar
  24. 24.
    Wang H, Riemer O, Rickens K, Brinksmeier E (2016) On the mechanism of asymmetric ductile–brittle transition in microcutting of (111) CaF2 single crystals. Scr Mater 114:21–26CrossRefGoogle Scholar
  25. 25.
    Blake PN, Scattergood RO (1990) Ductile-regime machining of germanium and silicon. J Am Ceram Soc 73:949–957CrossRefGoogle Scholar
  26. 26.
    Goel S, Luo X, Comley P, Reuben RL, Cox A (2013) Brittle–ductile transition during diamond turning of single crystal silicon carbide. Int J Mach Tools Manuf 65:15–21CrossRefGoogle Scholar
  27. 27.
    Arif M, Rahman M, San WY (2012) An experimental investigation into micro ball end-milling of silicon. J Manuf Process 14:52–61CrossRefGoogle Scholar
  28. 28.
    Yu D, Wong Y, Hong G (2011) Ultraprecision machining of micro-structured functional surfaces on brittle materials. J Micromech Microeng 21:095011CrossRefGoogle Scholar
  29. 29.
    Sun Z, To S, Zhang S (2018) A novel ductile machining model of single-crystal silicon for freeform surfaces with large azimuthal height variation by ultra-precision fly cutting. Int J Mach Tools Manuf 135:1–11CrossRefGoogle Scholar
  30. 30.
    Goel S, Luo X, Agrawal A, Reuben RL (2015) Diamond machining of silicon: a review of advances in molecular dynamics simulation. Int J Mach Tools Manuf 88:131–164CrossRefGoogle Scholar
  31. 31.
    Skorupa W, Yankov R (1996) Carbon-mediated effects in silicon and in silicon-related materials. Mater Chem Phys 44:101–143CrossRefGoogle Scholar
  32. 32.
    Sanz-Navarro C, Kenny S, Smith R (2004) Atomistic simulations of structural transformations of silicon surfaces under nanoindentation. Nanotechnology 15:692–697CrossRefGoogle Scholar
  33. 33.
    Zong W, Sun T, Li D, Cheng K, Liang Y (2008) XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer. Int J Mach Tools Manuf 48:1678–1687CrossRefGoogle Scholar
  34. 34.
    Pantea C (2004) Kinetics of diamond-silicon reaction under high pressure-high temperature conditionsGoogle Scholar

Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2018

Authors and Affiliations

  1. 1.State Key Laboratory in Ultra-precision Machining Technology, Department of Industrial and Systems EngineeringThe Hong Kong Polytechnic UniversityKowloonHong Kong

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