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Completely in situ and non-contact warpage assessment using 3D DIC with virtual patterning method

  • Jae B. KwakEmail author
ORIGINAL ARTICLE
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Abstract

Recently, advanced experimental mechanics have been developed using optical techniques for measuring 3D deformations of objects in industries. Especially, Moiré systems and 3D DIC (digital image correlation) were competing in characterizing warpage behaviors of electronics package under thermal loading with consideration of manufacturing process, which is accompanied by elevated temperatures. Both techniques conventionally require various surface treatments either physically or chemically, which involves contaminations on measuring objects. Additionally, excessive surface treatment results in reduction of measurement accuracy. Thus, in this study, truly in situ and non-contact 3D DIC method is developed using virtually generated speckle pattern. A commercial DLP (digital light processing) projector together with devised collimate lens system is used to project proper image of speckles on surface of specimen. The collimate lens system fully controls size of speckle image on such small area of electronics package. The feasibility of 3D DIC with virtual pattern is validated, and warpage characterization of PBGA (plastic ball grid array) package (15 mm × 15 mm) is successfully demonstrated.

Keywords

DIC (digital image correlation) DLP (digital light processing) PBGA (plastic ball grid array) Electronics package Warpage 

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Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2018

Authors and Affiliations

  1. 1.School of Mechanical System & Automotive EngineeringChosun UniversityGwangjuSouth Korea

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