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Simulation study on chip formation mechanism in grinding particle reinforced Cu-matrix composites

  • Chong SuEmail author
  • Xiaozhen Mi
  • Xiaoshuai Sun
  • Mingze Chu
ORIGINAL ARTICLE

Abstract

Based on the coupling method of finite element method and smoothed particle hydrodynamics method, the process of single abrasive grain cutting particles reinforced Cu-matrix composites with small volume fraction of particle phase is simulated, and the chip formation mechanism of particle reinforced Cu-matrix composites was analyzed. It can be concluded that the plastic removal of the Cu-matrix is still the main removal form of the composite, but the existence of the reinforced particle phase affects the cutting deformation behavior and the chip morphology. During the cutting process, the interfaces between part of reinforced particles and the Cu-matrix are broken, and resulting in the particles falling off into chips, but most of the particles will form continuous mixed chips with copper alloy, with the plastic deformation of the Cu-matrix. The extrusion of abrasive particles leads to pile-up of dislocation producing in Cu-matrix around the reinforced particle, which interferes with the continuous plastic deformation of Cu-matrix, thus affects the cutting force and cutting temperature of the abrasive grain. The simulation results show that with the increase of cutting speed, the cutting force decreases, but the cutting temperature increases. As the cutting depth increases, the cutting force and cutting temperature increase. The increase of reinforced particle content will lead to the increase of cutting force and cutting temperature.

Keywords

Particles reinforced Cu-matrix composites Grinding Chip formation Simulation 

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Notes

Acknowledgements

Thanks to my project research partners and fund support units.

Funding information

The work is supported by the Natural Science Foundation of Liaoning Province (201602136).

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Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2018

Authors and Affiliations

  • Chong Su
    • 1
    Email author
  • Xiaozhen Mi
    • 1
  • Xiaoshuai Sun
    • 1
  • Mingze Chu
    • 1
  1. 1.School of Mechanical EngineeringDalian Jiaotong UniversityDalianPeople’s Republic of China

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