Topology optimization for thermal stress reduction in power semiconductor module

  • Tadayoshi Matsumori
  • Atsushi Kawamoto
  • Tsuguo Kondoh
Brief Note


The present paper deals with the design of a power semiconductor module using topology optimization. The module must be capable of efficient heat conduction in order to maintain the performance of an electric device. In addition, thermal stress must be controlled in order to reduce product faults. In the present paper, we use density-based topology optimization to design the module so as to provide efficient cooling and reduce the thermal stress. Through numerical examples, we demonstrate that a radiating structure along the heat flux with slits is effective for relaxing the thermal stress while providing efficient heat conduction.


Topology optimization Thermo-elastic system Power semiconductor module 


Compliance with Ethical Standards

Conflict of interest

The authors declare that they have no conflict of interest.


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Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  1. 1.NagakuteJapan

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