Topology optimization for thermal stress reduction in power semiconductor module
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The present paper deals with the design of a power semiconductor module using topology optimization. The module must be capable of efficient heat conduction in order to maintain the performance of an electric device. In addition, thermal stress must be controlled in order to reduce product faults. In the present paper, we use density-based topology optimization to design the module so as to provide efficient cooling and reduce the thermal stress. Through numerical examples, we demonstrate that a radiating structure along the heat flux with slits is effective for relaxing the thermal stress while providing efficient heat conduction.
KeywordsTopology optimization Thermo-elastic system Power semiconductor module
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Conflict of interest
The authors declare that they have no conflict of interest.
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