Springer Nature is making SARS-CoV-2 and COVID-19 research free. View research | View latest news | Sign up for updates

Fabrication and electrostatic actuation of thin diaphragms

  • 74 Accesses

  • 4 Citations


In this paper, two kinds ofp + diaphragms are fabricated. One is flat, and the other is corrugated to release the residual stress resulted from the diffusion process. The two diaphragms are electrostatically actuated, and the center deflections of the diaphragms are measured for various frequencies. The static deflections of the flat diaphragm and the corrugated one estimated from the test results are compared with the calculated static deflections under residual tensile stress. The experimental result and the calculated result agree in the case of the flat diaphragm with a reasonable residual stress, but it is not true for the corrugated diaphragm. In the calculation, it is estimated that the corrugated diaphragm deflects more than the flat one. In the experiment, however, the corrugated diaphragm deflects less than the flat one.

This is a preview of subscription content, log in to check access.


  1. Ding, X. and Ko, W. H., 1991, “Buckling Behavior of Boron dopedp + Silicon Diaphragms,Tech. Digest, IEEE Transducers '91, pp. 93–96.

  2. Ding, X., Ko, W. H. and Mansour, J. M., 1989, “Residual Stress and Mechanical Properties of Boron dopedp + Silicon Films,”Proc., IEEE Transducers '89, Vol. 2, pp. 866–871.

  3. Hamberg, M. W., Neagu, C., Gardeniers, J. G. E., Intema, D. J. I. and Elwenspoek, M., 1995, “An electrochemical Micro Actuator,”IEEE Microelectromecanical Systems Workshop, pp. 106–110.

  4. Jerman, J. H., 1989. “The Fabrication and Use of Micromachined Corrugated Silicon Diaphragms,”Proc., IEEE Transducers '89, Vol. 2, pp. 988–992.

  5. Maseeh, F. and Senturia, S. D., 1989, “Plastic Deformation of Highly Doped Silicon,”Proc., IEEE Transducers '89, Vol. 2, pp. 861–865.

  6. Mullem, C. J., Gabriel, K. J. and Fujita, H., 1991, “Large Deflection Performance of Surface Micromachined Corrugated Diaphragms,”Tech. Digest, IEEE Transducers '91, pp. 1014–1017.

  7. Scheeper, P. R., Olthuis, W. and Bergveld, P., 1994, “The Design, Fabrication, and Testing of Corrugated Silicon Nitride Diaphragms,”Journal of Microelectromechanical Systems, Vol. 3, pp. 36–42.

  8. Spiering, V. L., Bouwstra, S., Spiering, R. M. E. J. and Elwenspoek, M., 1991, “On Chip Decoupling Zone for Package-stress reduction,”Tech. Digest, IEEE Transducers '91, pp. 982–985.

  9. Wilner, L. B., 1992, “Strain and Strain Relief in Highly Doped Silicon,”IEEE Solid-State Sensor and Actuator Workshop, pp. 76–77.

  10. Yang, E. H. and Yang, S. S., 1996, “The Quantitative Determination of the Residual Stress Profile in Oxidized p+ Silicon Films,”Sensors and Actuators A, Vol. 54, pp. 684–689.

  11. Zhang, Y. and Wise, K. D., 1993, “Performance of Non-Planar Silicon Diaphragms under Large Deflections,”IEEE Microelectromecanical Systems Workshop, pp. 284–288.

Download references

Author information

Correspondence to E. H. Yang.

Rights and permissions

Reprints and Permissions

About this article

Cite this article

Yang, E.H., Yang, S.S. & Jeong, O.C. Fabrication and electrostatic actuation of thin diaphragms. KSME International Journal 12, 161–169 (1998). https://doi.org/10.1007/BF02947160

Download citation

Key Words

  • p + Diaphragm
  • Electrostatic Actuation
  • Residual Stress
  • Corrugated Diaphragm
  • Dynamic Testing
  • Damping