Effect of the temperature dependence of thermal properties on the thermal shock tests of ceramics
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Thermal stress generated during a thermal shock is closely related to the fracture of ceramics. An attempt has been made to obtain thermal stress in a specimen by numerical calculation. The temperature dependence of thermal conductivity and diffusivity were introduced to realize the practical thermal conditions. The maximum thermal stress, σ max * , was recognized at the Fourier number, but differed from the temperature dependence. Correlative equations of σ max * and η max * with the Biot number, βi, under cooling or heating tests, have been proposed. These equations resulted in the exact σ max * and η max * compared with the previous equations, in which temperature dependence was ignored. The thermal shock resistance parameter was expressed by the correlative equations of σ max * in order to suggest adequate experimental conditions and specimen size. A comparison of the measured and calculated time to failure of the specimen led to confirmation of the fracture criterion. The measured time disagreed with the calculated one, if the fracture by thermal shocking was not predominant. The correlative equations were also useful to select the kind of ceramics subjected to thermal shocking.
KeywordsThermal Conductivity Thermal Stress Thermal Property Biot Thermal Condition
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