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Journal of Materials Science

, Volume 30, Issue 19, pp 4871–4878 | Cite as

Solid state intermetallic compound layer growth between copper and hot dipped indium coatings

  • P. T. Vianco
  • A. C. Kilgo
  • R. Grant
Article

Abstract

Solid state growth of intermetallic compound layers that form between hot dipped indium coatings and copper was investigated in diffusion couples aged at temperatures of 70, 100 and 135 °C and time periods of up to 300 days. At an annealing temperature of 70 °C, the metastable composition, Cu36In64, was observed at the interface. Ageing at 100 °C caused a dual layer structure with the Cu36In64 layer joined by a copper-rich intermetallic compound, Cu11In9, that is noted in the equilibrium phase diagram. An annealing temperature of 135 °C caused the eventual development of a single copper-rich intermetallic layer, Cu57In43, at the interface. Total intermetallic layer thickness was documented as a function of ageing time and temperature, exhibiting at1/2 dependence with an apparent activation energy of 20 kJ mol−1.

Keywords

Activation Energy Intermetallic Compound Ageing Time Apparent Activation Energy Diffusion Couple 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Chapman & Hall 1995

Authors and Affiliations

  • P. T. Vianco
    • 1
  • A. C. Kilgo
    • 1
  • R. Grant
    • 1
  1. 1.Center for Solder Science and TechnologySandia National LaboratoriesAlbuquerqueUSA

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