Journal of Materials Science

, Volume 30, Issue 19, pp 4871–4878 | Cite as

Solid state intermetallic compound layer growth between copper and hot dipped indium coatings

  • P. T. Vianco
  • A. C. Kilgo
  • R. Grant


Solid state growth of intermetallic compound layers that form between hot dipped indium coatings and copper was investigated in diffusion couples aged at temperatures of 70, 100 and 135 °C and time periods of up to 300 days. At an annealing temperature of 70 °C, the metastable composition, Cu36In64, was observed at the interface. Ageing at 100 °C caused a dual layer structure with the Cu36In64 layer joined by a copper-rich intermetallic compound, Cu11In9, that is noted in the equilibrium phase diagram. An annealing temperature of 135 °C caused the eventual development of a single copper-rich intermetallic layer, Cu57In43, at the interface. Total intermetallic layer thickness was documented as a function of ageing time and temperature, exhibiting at1/2 dependence with an apparent activation energy of 20 kJ mol−1.


Activation Energy Intermetallic Compound Ageing Time Apparent Activation Energy Diffusion Couple 
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Copyright information

© Chapman & Hall 1995

Authors and Affiliations

  • P. T. Vianco
    • 1
  • A. C. Kilgo
    • 1
  • R. Grant
    • 1
  1. 1.Center for Solder Science and TechnologySandia National LaboratoriesAlbuquerqueUSA

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