An investigation was made of the kinetics of changes in the flow stress σ0.1, modulation period λ, and electrical resistivity ρ in the course of ageing of Cu-Ti, Cu-Ti-Al, Cu-Ti-Zn, and Cu-Ti-Ga alloys. There were no dispersion hardening effects during the early stages of the precipitation, corresponding to the λ = const condition. An increase in σ0.1. was observed during the stage of coagulation of the secondary phases. The increase in the flow stress was described using a theory of hardening by coherent particles of the new phase but it did not agree with the theory of hardening of alloys exhibiting spinodal precipitation.
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Pshenina, L.S., Nazarov, Y.K. & Korotaev, A.D. Kinetics of changes in the modulation period and in dispersion hardening in Cu-Ti-Me alloys. Soviet Physics Journal 23, 429–435 (1980). https://doi.org/10.1007/BF00891635
- Electrical Resistivity
- Flow Stress
- Secondary Phasis
- Modulation Period