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Kinetics of changes in the modulation period and in dispersion hardening in Cu-Ti-Me alloys

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Abstract

An investigation was made of the kinetics of changes in the flow stress σ0.1, modulation period λ, and electrical resistivity ρ in the course of ageing of Cu-Ti, Cu-Ti-Al, Cu-Ti-Zn, and Cu-Ti-Ga alloys. There were no dispersion hardening effects during the early stages of the precipitation, corresponding to the λ = const condition. An increase in σ0.1. was observed during the stage of coagulation of the secondary phases. The increase in the flow stress was described using a theory of hardening by coherent particles of the new phase but it did not agree with the theory of hardening of alloys exhibiting spinodal precipitation.

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Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 5, pp. 81–87, May, 1980.

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Pshenina, L.S., Nazarov, Y.K. & Korotaev, A.D. Kinetics of changes in the modulation period and in dispersion hardening in Cu-Ti-Me alloys. Soviet Physics Journal 23, 429–435 (1980). https://doi.org/10.1007/BF00891635

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Keywords

  • Precipitation
  • Electrical Resistivity
  • Flow Stress
  • Secondary Phasis
  • Modulation Period